板上安装温度传感器 1C Accurate 8Ch Temperature Sensor
| 参数名称 | 属性值 |
| 厂商名称 | Maxim(美信半导体) |
| 产品种类 | 板上安装温度传感器 |
| 输出类型 | Digital |
| 配置 | Local, Remote |
| 准确性 | +/- 1 C |
| 电源电压-最小 | 3 V |
| 电源电压-最大 | 3.6 V |
| 接口类型 | 2-Wire, I2C, SMBus |
| 分辨率 | 11 bit |
| 最小工作温度 | - 40 C |
| 最大工作温度 | + 125 C |
| 关闭 | Shutdown |
| 温度阈值 | Programmable |
| 安装风格 | SMD/SMT |
| 封装 / 箱体 | TQFN-24 |
| 产品 | Multichannel Sensor |
| 封装 | Tube |
| 系列 | MAX6581 |
| 工作电源电流 | 4 uA |
| Pd-功率耗散 | 2.222 W |
| 工厂包装数量 | 75 |
| MAX6581TG9C+ | MAX6581TG98+T | MAX6581TG9E+ | MAX6581TG9A+ | MAX6581TG98+ | MAX6581TG9A+T | |
|---|---|---|---|---|---|---|
| 描述 | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor | 板上安装温度传感器 1C Accurate 8Ch Temperature Sensor |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | - | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | - | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 |
| 长度 | - | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | YES | YES |
| 技术 | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | - | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
| Factory Lead Time | - | - | 14 weeks | 15 weeks | 14 weeks | 15 weeks |
| JESD-609代码 | - | - | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | - | - | 1 | 1 | 1 | 1 |
| 端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
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