HMMC-3128
DC-12 GHz Packaged High Efficiency Divide-by-8 Prescaler
HMMC-3128-TR1 - 7” diameter reel/500 each
HMMC-3128-BLK - Bubble strip/10 each
Data Sheet
Description
The HMMC-3128 is a packaged GaAs HBT MMIC
prescaler which offers dc to 12 GHz frequency
translation for use in communications and EW systems
incorporating high–frequency PLL oscillator circuits and
signal–path down conversion applications. The
prescaler provides a large input power sensitivity
window and low phase noise.
Package Details
Package Type: SOIC-8 Plastic
Package Dimensions: 4.9 x 3.9 mm typ
Package Thickness: 1.55 mm typ
Lead Pitch: 1.25 mm nom
Lead Width: 0.42 mm nom
Features
•
Wide Frequency Range: 0.2–12 GHz
•
High Input Power Sensitivity:
On–chip pre– and post–amps
-15 to +10 dBm (1–8 GHz)
-10 to +8 dBm (8–10 GHz)
-5 to +2 dBm (10–12 GHz)
•
P
out
: 0 dBm (0.5 V
p-p
)
•
Low Phase Noise: -153 dBc/Hz @ 100 kHz Offset
•
(+) or (-) Single Supply Bias Operation
•
Wide Bias Supply Range: 4.5 to 6.5 volt operating
range
•
Differential I/0 with on–chip 50Ω matching
Absolute Maximum Ratings
1
(@ TA = +25 °C, unless otherwise stated)
Symbol
V
CC
V
EE
|V
CC
- V
EE
|
V
Logic
P
in(CW)
V
RFin
T
BS2
T
st
T
max
Parameters/Conditions
Bias Supply Voltage
Bias Supply Voltage
Bias Supply Delta
Logic Threshold Voltage
CW RF Input Power
DC Input Voltage (@ RFin or RF
in
Ports)
Backside Operating Temperature
Storage Temperature
Maximum Assembly Temperature (60 seconds max)
Min
Max
+7
Units
volts
volts
-7
+7
V
CC
- 1.5
V
CC
-1.2
+10
V
CC
±0.5
-40
-65
+85
+165
310
volts
volts
dBm
volts
°C
°C
°C
Notes:
1. Operation in excess of any parameter limit (except T
BS
) may cause permanent damage to the device.
2. MTTF >1 x 10
6
hours @ T
BS
<85°C. Operation in excess of maximum operating temperature (T
BS
) will degrade MTTF.
DC Specifications/Physical Properties
(T
A
= +25 °C, V
CC
- V
EE
= 5.0 volts, unless otherwise listed)
Symbol
V
CC
- V
EE
|I
CC
| or |I
EE
|
V
RFin(q)
V
RFout(q)
V
Logic
Parameters/Conditions
Operating bias supply difference
1
Bias supply current
Quiescent dc voltage appearing at all RF ports
Min
4.5
37
Typ
5.0
44
V
CC
Max
6.5
51
Units
volts
mA
volts
Nominal ECL Logic Level
(V
Logic
contact self-bias voltage, generated on-chip)
V
CC
-1.45
V
CC
-1.32
V
CC
-1.25
volts
Notes:
1. Prescaler will operate over full specified supply voltage range. V
CC
or V
EE
not to exceed limits specified in Absolute Maximum Ratings
section.
2
RF Specifications
(T
A
= +25 °C, Z
0
= 50
Ω,
V
CC
- V
EE
= 5.0 volts)
Symbol
ƒ
in(max)
ƒ
in(min)
ƒ
Sel-Osc.
P
in
Parameters/Conditions
Maximum input frequency of operation
Minimum input frequency of operation
1
(P
in
= -10 dBm)
Output Self-Oscillation Frequency
2
@ dc, (Square-wave input)
@ ƒ
in
= 500 MHz, (Sine-wave input)
ƒ
in
= 1 to 8 GHz
ƒ
in
= 8 to 10 GHz
ƒ
in
= 10 to 12 GHz
Min
12
Typ
14
0.2
3.4
Max
Units
GHz
0.5
GHz
GHz
-15
-15
-15
-10
-5
>-25
>-20
>-20
>-15
>-10
15
30
-153
+10
+10
+10
+5
-1
dBm
dBm
dBm
dBm
dBm
dB
dB
dBc/Hz
RL
S
12
j
N
Small-Signal Input/Output Return Loss (@ ƒ
in
<10 GHz)
Small-Signal Reverse Isolation (@ ƒ
in
<10 GHz)
SSB Phase noise (@ P
in
= 0 dBm, 100 KHz offset from a ƒ
ou
t =
1.2 GHz Carrier)
Input signal time variation @ zero-crossing (ƒ
in
= 10 GHz, P
in
=
-10 dBm)
Output transition time (10% to 90% rise/fall time)
@ ƒ
out
< 1 GHz
@ ƒ
out
= 2.5 GHz
@ ƒ
out
= 3.0 GHz
-2.0
-3.5
-4.5
Jitter
1
ps
T
r
or T
f
P
out3
70
0.0
-1.5
-2.5
0.5
0.42
0.37
-50
ps
dBm
dBm
dBm
volts
volts
volts
dBm
|V
out(p-p)
|
4
@ ƒ
out
< 1 GHz
@ ƒ
out
= 2.5 GHz
@ ƒ
out
= 3.0 GHz
P
Spitback
ƒ
out
power level appearing at RF
in
or RF
out
(@ ƒ
in
10 GHz,
Unused RF
out
or RF
out
unterminated)
ƒ
out
power level appearing at RF
in
or RF
out
(@ ƒ
in
10 GHz, Both
RF
out
or RF
out
unterminated)
-55
dBm
P
feedthru
H
2
Power level of ƒ
in
appearing at RF
out
or RF
out
(@ ƒ
in
= 12 GHz,
Pin = 0 dBm, Referred to P
in
(ƒ
in
))
Second harmonic distortion output level (@ ƒ
out
= 3.0 GHz,
Referred to P
out
(ƒ
out
))
-30
dBc
-25
dBc
Notes:
1. For sine–wave input signal. Prescaler will operate down to dc for square–wave input signal. Min. divide frequency limited by input slew
rate.
2. Prescaler can exhibit this output signal under bias in the absence of an RF input signal. This condition can be eliminated by use of the
Input dc offset technique described on page 4.
3. Fundamental of output square wave’s Fourier Series.
4. Square wave amplitude calculated from P
out
.
3
Applications
The HMMC-3128 is designed for use in high frequency
communications, microwave instrumentation, and EW
radar systems where low phase–noise PLL control
circuitry or broad–band frequency translation is
required.
Operation
The device is designed to operate when driven with
either a single–ended or differential sinusoidal input
signal over a 200 MHz to 12 GHz bandwidth. Below
200 MHz the prescaler input is “slew–rate” limited,
requiring fast rising and falling edge speeds to properly
divide. The device will operate at frequencies down to
dc when driven with a square–wave.
Due to the presence of an off– chip RF–bypass
capacitor inside the package (connected to the V
CC
contact on the device), and the unique design of the
device itself, the component may be biased from either
a single positive or single negative supply bias. The
backside of the package is not dc connected to any dc
bias point on the device.
For positive supply operation, V
CC
pins are nominally
biased at any voltage in the +4.5 to +6.5 volt range
with pin 8 (V
EE
) grounded. For negative bias operation
V
CC
pins are typically grounded and a negative voltage
between -4.5 to -6.5 volts is applied to pin 8 (V
EE
).
ac–Coupling and dc–Blocking
All RF ports are dc connected on–chip to the V
CC
contact through on–chip 50Ω resistors. Under any bias
conditions where V
CC
is not dc grounded the RF ports
should be ac coupled via series capacitors mounted
on the PC– board at each RF port. Only under bias
conditions where V
CC
is dc grounded (as is typical for
negative bias supply operation) may the RF ports be
direct coupled to adjacent circuitry or in some cases,
such as level shifting to subsequent stages. In the latter
case the package heat sink may be “floated” and bias
applied as the difference between V
CC
and V
EE
.
Input dc Offset
If an RF signal with sufficient signal to noise ratio is
present at the RF input lead, the prescaler will operate
and provide a divided output equal the input frequency
divided by the divide modulus. Under certain “ideal”
conditions where the input is well matched at the right
input frequency, the component may “self–oscillate”,
especially under small signal input powers or with only
noise present at the input. This “self–oscillation” will
produce an undesired output signal also known as a
false trigger. To prevent false triggers or self– oscillation
conditions, apply a 20 to 100 mV dc offset voltage
between the RFin and RFin ports. This prevents noise
or spurious low level signals from triggering the divider.
Adding a 10KΩ resistor between the unused RF input
to a contact point at the VEE potential will result in an
offset of » 25mV between the RF inputs. Note, however,
that the input sensitivity will be reduced slightly due
to the presence of this offset.
V
CC
6
V
CC
4
V
CC
2
150p
Vcc
By
poss
Vcc
Vcc
50
50
OUT
50
50
IN
IN
5
7
IN
÷
IN
Vee
Vpwr
sel
3
OUT
OUT
OUT
Pin 1
SOIC8 w/Backside GND
8
V
EE
Figure 1. Simplified Schematic
4
Assembly Notes
Independent of the bias applied to the package, the
backside of the package should always be connected
to both a good RF ground plane and a good thermal
heat sinking region on the PC–board to optimize
performance. For single–ended output operation the
unused RF output lead should be terminated into 50Ω
to a contact point at the V
CC
potential or to RF ground
through a dc blocking capacitor.
A minimum RF and thermal PC board contact area
equal to or greater than 2.67 x 1.65 mm (0.105" x
0.065") with eight 0.020" diameter plated–wall thermal
vias is recommended.
MMIC ESD precautions, handling considerations, die
attach and bonding methods are critical factors in
successful GaAs MMIC performance and reliability.
Avago Technologies application note #54, “GaAs MMIC
ESD, Die Attach and Bonding Guidelines” provides
basic information on these subjects.
Moisture Sensitivity Classification: Class 1, per JESD22-
A112-A.
Additional References:
PN #18, “HBT Prescaler Evaluation Board.”
Notes:
- All dimensions in millimeters.
- Refer to JEDEC Outline MS-012 for additional tolerances.
- Exposed heat slug area on pkg bottom = 2.67 x 1.65
- Exposed heat sink on package bottom must be soldered to PCB
RF ground plane.
Symbol
A
A1
B
C
D
E
e
H
L
a
Min
1.35
0.0
0.33
0.19
4.80
3.80
Max
1.75
.25
0.51
.025
5.00
4.00
1.27 BSC
5.80
0.40
0°
6.20
1.27
8°
Figure 2. Package & Dimensions
VCC (+4 .5 to +6 .5 vo lts)
~ 1 mf Mon o b lo ck
C apacito r
To operate component from a negative supply, ground each
VCCconnection and supply VEE witha negative voltage (-4.5
to -6.5v) bypassed to ground with~1 m capacitor.
f
HMM
C-3128
9618
RFin
VCC
RFin
VEE
VCC
RFout
VCC
RFout
RFout should be terminated in 50Ω to ground. (dc blocking
capacitor required for positive bias configuration.)
Exposed heat sink on package bottom
must be soldered to PCB RF ground.
Figure 3. Assembly Diagram
(Single-supply, Positive-bias Configuration shown)
5
Microchip MCU
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