16GB (x72, ECC, DR) 288-Pin DDR4 UDIMM
Features
DDR4 SDRAM UDIMM
MTA18ASF2G72AZ – 16GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, unbuffered dual in-line memory module
(UDIMM)
• Fast data transfer rates: PC4-3200, PC4-2666, or
PC4-2400
• 16GB (2 Gig x 72)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V
REFDQ
generation and calibration
• Dual-rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 4 internal device bank groups with 4 banks per
group produce 16 device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
PC4-
24
22/
21
3200/
–
2933/
2933
t
RCD
t
RP
t
RC
Figure 1: 288-Pin UDIMM (MO-309, R/C-E1)
Module height: 31.25mm (1.23in)
Options
• Operating temperature
– Commercial
(0°C
≤
T
OPER
≤
95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.625ns @ CL = 22 (DDR4-3200)
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
Marking
None
Z
-3G2
-2G6
-2G3
Speed
Grade
20
19
18
2400
2400
17
16
15
14
13
12
11
10
9
–
–
(ns)
(ns)
(ns)
-3G2 3200 3200
-2G9 2933
–
2666 2666
2666 2666
2400 2133 2133 1866 1866 1600 1600 1333
2400 2133 2133 1866 1866 1600 1600 1333
13.75 13.75 45.75
14.32 14.32 46.32
PDF: CCMTD-1725822587-9907
asf18c2gx72az.pdf – Rev. E 11/17 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 UDIMM
Features
Table 1: Key Timing Parameters (Continued)
Data Rate (MT/s)
CL =
PC4-
24
–
–
–
22/
21
–
–
–
t
RCD
t
RP
t
RC
Speed
Grade
20
–
–
19
–
–
18
2400
2400
–
17
16
15
14
13
12
11
10
9
–
–
(ns)
(ns)
(ns)
-2G6 2666
-2G3 2400
-2G1 2133
2666 2666
2400 2133 2133 1866 1866 1600 1600 1333
2400 2133 2133 1866 1866 1600 1600 1333
–
14.16 14.16 46.16
14.16 14.16 46.16
13.5
46.5
2133 2133 1866 1866 1600 1600 1333 1333 13.5
Table 2: Addressing
Parameter
Row address
Column address
Device bank group address
Device bank address per group
Device configuration
Module rank address
16GB
64K A[15:0]
1K A[9:0]
4 BG[1:0]
4 BA[1:0]
8Gb (1 Gig x 8), 16 banks
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 16GB Modules
Base device: MT40A1G8,
1
8Gb DDR4 SDRAM
Module
2
Part Number
Density
MTA18ASF2G72AZ-3G2__
MTA18ASF2G72AZ-2G6__
MTA18ASF2G72AZ-2G3__
Notes:
16GB
16GB
16GB
Module
Bandwidth
25.6 GB/s
21.3 GB/s
19.2 GB/s
Memory Clock/
Data Rate
0.625ns/3200
MT/s
0.75ns/2666 MT/s
0.83ns/2400 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
22-22-22
19-19-19
17-17-17
Configuration
2 Gig x 72
2 Gig x 72
2 Gig x 72
1. The data sheet for the base device can be found at
micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA18ASF2G72AZ-3G2E1.
PDF: CCMTD-1725822587-9907
asf18c2gx72az.pdf – Rev. E 11/17 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2015 Micron Technology, Inc. All rights reserved.
16GB (x72, ECC, DR) 288-Pin DDR4 UDIMM
Features
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications.
Products are not designed or intended for use in automotive applications unless specifi-
cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-
demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications.
Products are not authorized for use in applications in which failure of the Micron compo-
nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-
mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-
cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility.
Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-
URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-
vironmental damages will result from failure of any semiconductor component.
Limited Warranty.
In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
PDF: CCMTD-1725822587-9907
asf18c2gx72az.pdf – Rev. E 11/17 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2015 Micron Technology, Inc. All rights reserved.
电源技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
