16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
DDR4 SDRAM SODIMM
MTA16ATF2G64HZ – 16GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 260-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC4-3200, PC4-2666, or
PC4-2400
• 16GB (2 Gig x 64)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die V
REFDQ
generation and calibration
• Dual-rank
• On-board I
2
C serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
PC4-
3200
2933
2666
24
3200,
2933
–
–
22
3200,
2933
2933
–
21
2933
2933
–
20 \
19
2666 \
2666
2666 \
2666
2666 \
2666
18 \
17
2400 \
2400
2400 \
2400
2400 \
2400
16 \
15
2133 \
2133
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
1600 \
1600
10 \
9
1333 \
–
t
RCD
t
RP
t
RC
Figure 1: 260-Pin SODIMM (MO-310, R/C E1)
Module height: 30mm (1.181in)
Options
• Operating temperature
– Commercial (0°C
≤
T
OPER
≤
95°C)
• Package
– 260-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
Marking
None
Z
-3G2
-2G6
-2G3
Speed
Grade
(ns)
13.75
(ns)
13.75
(ns)
45.75
-3G2
-2G9
-2G6
1333 \ 14.32
14.32
46.32
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \ 14.25
14.25
46.25
1
(13.75)
1
(45.75)
1
–
(13.75)
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
Table 1: Key Timing Parameters (Continued)
Data Rate (MT/s)
CL =
PC4-
2400
2133
24
–
–
22
–
–
21
–
–
20 \
19
–
–
18 \
17
2400 \
2400
–
16 \
15
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
10 \
9
t
RCD
t
RP
t
RC
Speed
Grade
(ns)
(ns)
(ns)
-2G3
-2G1
1333 \ 14.16
14.16
46.16
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \
1333
14.06
(13.5)
1
14.06
(13.5)
1
47.06
(46.5)
1
Note:
1. Down-bin timing, refer to component data sheet Speed Bin Tables for details.
Table 2: Addressing
Parameter
Row address
Column address
Device bank group address
Device bank address per group
Device configuration
Module rank address
16GB
64K A[15:0]
1K A[9:0]
4 BG[1:0]
4 BA[1:0]
8Gb (1 Gig x 8), 16 banks
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 16GB Modules
Base device: MT40A1G8,
1
8Gb DDR4 SDRAM
Module
2
Part Number
Density
MTA16ATF2G64HZ-3G2__
MTA16ATF2G64HZ-2G6__
MTA16ATF2G64HZ-2G3__
Notes:
16GB
16GB
16GB
Module
Bandwidth
25.6 GB/s
21.3 GB/s
19.2 GB/s
Memory Clock/
Data Rate
0.62ns/3200 MT/s
0.75ns/2666 MT/s
0.83ns/2400 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
22-22-22
19-19-19
17-17-17
Configuration
2 Gig x 64
2 Gig x 64
2 Gig x 64
1. The data sheet for the base device can be found on micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA16ATF2G64HZ-3G2J1.
CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
16GB (x64, DR) 260-Pin DDR4 SODIMM
Features
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including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
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CCMTD-1725822587-9882
atf16c2gx64hz.pdf – Rev. I 10/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
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