SERVER-CLASS EMBEDDED PERFORMANCE
conga-TS370
-
8
th
Generation Intel
®
Core
™
processor
with up to 6 Cores
-
Intel
®
Xeon
®
processors for data center applications
-
Support for USB 3.1 Gen2 with 10Gb/s
-
Intel
®
Optane
™
memory support
-
ECC memory support
-
Up to 32 GByte dual channel DDR4 memory
Formfactor
CPU
COM Express
®
Basic, (95 x 125 mm), Type 6 Connector Pinout
Intel
®
Xeon
®
E-2176M Processor
Intel
®
Core
™
i7-8850H Processor
Intel
®
Core
™
i5-8400H Processor
4.4 GHz (Boost) | 2.7 GHz Clock
4.3 GHz (Boost) | 2.6 GHz Clock
4.2 GHz (Boost) | 2.5 GHz Clock
Hexa Core
Hexa Core
Quad Core
12 MB cache
9 MB cache
8 MB cache
45 W (35 W cTDP)
45 W (35 W cTDP)
45 W (35 W cTDP)
Intel
®
Turbo Boost Technology | Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) | Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)
Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) | Integrated dual channel memory controller | up to 42,6 GByte/sec. memory
bandwidth | Integrated Intel
®
Gen9 HD Graphics with frequency up to 1GHz | Intel
®
Clear Video HD Technology | Intel
®
Virtualization Technology
(Intel
®
VT) | Intel
®
Trusted Execution Technology (Intel
®
TXT) | Intel
®
Secure Key
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets, SO-DIMM DDR4 up to 2666 MT/s and 32GByte dual channel, optionally with ECC support (Intel
®
Xeon
®
)
Mobile Intel
®
PCH-H QM370 Series or CM246 Series for Intel Xeon Processor
Intel
®
i219-LM GbE LAN Controller with AMT 12.0 support
8x PCI Express
™
Gen 3.0 lanes | 1x PEG x16 Gen 3 | 4x SATA Gen 3 |
4x USB
3.1 Gen 2 @ 10 GB/s | 8x USB 2.0 | LPC bus |
I²C bus (fast mode, 400 kHz, multi-master) | 2x UART
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Gen9 UHD Graphics Engine with OpenCL 2.0, OpenGL 4.3 / 4.4 and DirectX 11/12 (for Windows 10) support | up to three independent displays:
HDMI 1.4a / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support
@ 40 MBit/s | HEVC, VP9 and VDENC encoding
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 |
Automatic Panel Detection via EDID/EPI | LVDS or eDP switchable in BIOS setup
3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA support
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup |
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 32 MByte serial SPI firmware flash
The conga-TS370 is equipped with a discrete ”Trusted Platform Module” (TPM 2.0). It is capable of calculating efficient hash and RSA algorithms with
key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit
also with improved authentication, integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 10 (64bit only) | Microsoft
®
Windows 10 IoT Enterprise (64bit only) | Linux
See User’s Guide for full details
Operating: 0 .. +60°C
Storage: -40 .. +85°C
Storage: 5 - 95% r. H. non cond.
LVDS / eDP
Digital Display Interface (DDI)
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
www.congatec.com
conga-TS370
| Order Information
Article
conga-TS370/i7-8850H
conga-TS370/i5-8400H
conga-TS370/E-2176M
PN
049000
049001
049002
Description
COM Express Type 6 Basic module with Coffeelake-H Intel
®
Core
™
i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2
graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel
®
Core
™
i5-8400H quad core processor with 2.5GHz, 8MB L2 cache,
GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
COM Express Type 6 Basic module with Coffeelake-H Intel
®
Xeon
®
Processor E-2176M, hexa core processor with 2.7GHz, 12MB
L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Article
conga-TS170/HSP-HP-B
conga-TS170/HSP-HP-T
conga-TS170/CSP-HP-B
conga-TS170/CSP-HP-T
conga-TS170/CSA-HP-B
conga-TS170/CSA-HP-T
PN
045934
045935
045932
045933
045930
045931
Description
Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes.
All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes.
All standoffs are M2.5mm thread.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat
pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat
pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat
pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat
pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
4 GByte DDR4 SODIMM memory module with 2666 MT/s
8 GByte DDR4 SODIMM memory module with 2666 MT/s
16 GByte DDR4 SODIMM memory module with 2666 MT/s
4 GByte DDR4 ECC SODIMM memory module with 2666 MT/s
8 GByte DDR4 ECC SODIMM memory module with 2666 MT/s
16 GByte DDR4 ECC SODIMM memory module with 2666 MT/s
4 GByte DDR4 SODIMM memory module with 2400 MT/s
8 GByte DDR4 SODIMM memory module with 2400 MT/s
16 GByte DDR4 SODIMM memory module with 2400 MT/s
4 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
8 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
16 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
Evaluation carrier board for Type 6 COM Express Modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards, height 5mm, packing unit 4 pieces
Connector for COM-Express carrier boards, height 8mm, packing unit 4 pieces
DDR4-SODIMM-2666 (4GB)
DDR4-SODIMM-2666 (8GB)
DDR4-SODIMM-2666 (16GB)
DDR4-SODIMM-2666 ECC (4GB)
DDR4-SODIMM-2666 ECC (8GB)
DDR4-SODIMM-2666 ECC (16GB)
DDR4-SODIMM-2400 (4GB)
DDR4-SODIMM-2400 (8GB)
DDR4-SODIMM-2400 (16GB)
DDR4-SODIMM-2400 ECC (4GB)
DDR4-SODIMM-2400 ECC (8GB)
DDR4-SODIMM-2400 ECC (16GB)
conga-TEVA2
conga-LDVI/EPI
COMe-carrier-board-Socket-5
COMe-carrier-board-Socket-8
067780
067781
067782
067783
067784
067785
068790
068791
068792
068795
068796
068797
065810
011115
400007
400004
© 2018 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. October 12, 2018 MR
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