SOIC-20, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 针数 | 20 |
| 制造商包装代码 | PS20 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 100000000 Hz |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 7 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 74LVC374ASO | LVC374AU | 74LVC374APY | 74LVC374AQ | 74LVC374APG | 74LVC374AQ8 | 74LVC374APY8 | 74LVC374ASO8 | 74LVC374APG8 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SOIC-20, Tube | WAFER-0, Wafer | SSOP-20, Tube | QSOP-20, Tube | TSSOP-20, Tube | QSOP-20, Reel | SSOP-20, Reel | SOIC-20, Reel | TSSOP-20, Reel |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | WAFER | SSOP | QSOP | TSSOP | QSOP | SSOP | SOIC | TSSOP |
| 针数 | 20 | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | PS20 | DICE | PY20 | PC20 | PG20 | PC20 | PY20 | PS20 | PG20 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Is Samacsys | N | N | N | N | N | N | N | N | N |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | 225 | NOT SPECIFIED | 240 | 240 | 240 | 240 | 240 | 225 | 240 |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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