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SEAF8-10-05.0-L-04-2-K

产品描述板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
产品类别连接器    连接器   
文件大小1MB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

SEAF8-10-05.0-L-04-2-K概述

板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket

SEAF8-10-05.0-L-04-2-K规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
Factory Lead Time3 weeks
主体宽度0.169 inch
主体长度0.545 inch
主体/外壳类型SOCKET
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (10)
联系完成终止Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料COPPER ALLOY
触点模式RECTANGULAR
触点样式BELLOWED TYPE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
绝缘体颜色BLACK
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码e3
MIL 符合性NO
插接触点节距0.032 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数4
装载的行数4
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
电镀厚度10u inch
额定电流(信号)1.3 A
可靠性COMMERCIAL
端子节距0.8 mm
端接类型SURFACE MOUNT
触点总数40
Base Number Matches1

文档预览

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F-219
SEAF8–50–05.0–S–10–2–K
SEAF8–30–05.0–S–04–2–K
(0.80 mm) .0315"
SEAF8 SERIES
ULTRA-HIGH DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF8
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Working Voltage:
220 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM8
Cable Mates:
ESCA
Standoffs:
JSO
Signal Integrity optimized
Edge Rate
®
contact
Lead-Free
solder charge
terminations
POWER/SIGNAL
APPLICATION
7 mm and 10 mm
stack heights
4, 6, 8 and
10 rows
Up to 500 I/Os
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
HIGH-SPEED CHANNEL PERFORMANCE
SEAM8/SEAF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
SEAF8
NO. PINS
PER ROW
05.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
K
= Polyimide
film Pick &
Place Pad
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other pin counts
–10, – 20, – 30, –40, –50
(Standard sizes)
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
=Four Rows
– 04
– 06
– 08
– 10
= Lead-Free
Solder Charge
–2
–K
=Six Rows
MATED HEIGHT*
SEAF8
LEAD
STYLE
SEAM8 LEAD STYLE
–S02.0
–S05.0
(10.00) .394
–05.0
(7.00) .276
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
=Eight Rows
=Ten Rows
*Processing conditions will affect
mated height.
NO. OF
ROWS
–04
A
(4.30)
.169
(6.30)
.248
(8.30)
.327
(10.30)
.406
No. of positions x
(0.80) .0315 + (5.84) .230
(0.75)
.029
06
–06
–08
A
01
–10
(1.27)
.050
Notes:
Patent Pending
Tape & Reel packaging
is standard.
Some sizes, styles and
options are non-standard,
non-returnable.
(4.57)
.180
(1.10) (1.32)
(1.32)
.043 x .052
.052 DIA
No. of positions x
(0.80) .0315 + (2.56) .101
(2.87)
.113
(0.80)
.0315
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

 
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