模数转换器 - ADC 12-Bit 8Ch 133ksps 5.25V Precision ADC
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | SSOP |
包装说明 | SSOP, |
针数 | 20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大模拟输入电压 | 1.25 V |
最小模拟输入电压 | -1.25 V |
最长转换时间 | 65 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e3 |
长度 | 7.2 mm |
最大线性误差 (EL) | 0.0488% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 8 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
采样速率 | 0.133 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 1.99 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5.29 mm |
Base Number Matches | 1 |
MAX147CCAP+ | MAX147AEPP+ | MAX147AEAP+ | MAX14629EETJ+T | MAX146ACAP+T | MAX147CEAP+T | MAX146AEAP+T | MAX146BCPP+ | MAX147CEAP+ | |
---|---|---|---|---|---|---|---|---|---|
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是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SSOP | DIP | SSOP | - | SSOP | - | SSOP | DIP | SSOP |
包装说明 | SSOP, | DIP, DIP20,.3 | SSOP, SSOP20,.3 | - | SSOP, SSOP20,.3 | SSOP, | SSOP, SSOP20,.3 | DIP, DIP20,.3 | SSOP, |
针数 | 20 | 20 | 20 | - | 20 | - | 20 | 20 | 20 |
Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 1.25 V | 1.25 V | 1.25 V | - | 2.5 V | 2.65 V | 2.5 V | 2.5 V | 1.25 V |
最小模拟输入电压 | -1.25 V | -1.25 V | -1.25 V | - | - | -2.65 V | - | - | -1.25 V |
最长转换时间 | 65 µs | 65 µs | 65 µs | - | 65 µs | 65 µs | 65 µs | 65 µs | 65 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e3 | e3 | e3 | - | e3 | e3 | e3 | e3 | e3 |
长度 | 7.2 mm | 26.16 mm | 7.2 mm | - | 7.2 mm | 7.2 mm | 7.2 mm | 26.16 mm | 7.2 mm |
最大线性误差 (EL) | 0.0488% | 0.0122% | 0.0122% | - | 0.0122% | 0.0488% | 0.0122% | 0.0244% | 0.0488% |
湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
位数 | 12 | 12 | 12 | - | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 85 °C | 85 °C | - | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | - | - | -40 °C | -40 °C | - | -40 °C |
输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | - | BINARY | 2\'S COMPLEMENT BINARY | BINARY | BINARY | BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | DIP | SSOP | - | SSOP | SSOP | SSOP | DIP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 0.133 MHz | 0.133 MHz | 0.133 MHz | - | 0.133 MHz | 0.133 MHz | 0.133 MHz | 0.133 MHz | 0.133 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | - | TRACK | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 1.99 mm | 4.572 mm | 1.99 mm | - | 1.99 mm | 1.99 mm | 1.99 mm | 4.572 mm | 1.99 mm |
标称供电电压 | 5 V | 5 V | 5 V | - | 3 V | - | 3 V | 3 V | 5 V |
表面贴装 | YES | NO | YES | - | YES | YES | YES | NO | YES |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | MATTE TIN (800) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | - | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 0.65 mm | 2.54 mm | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | - | 30 | 30 | 30 | 30 | 30 |
宽度 | 5.29 mm | 7.62 mm | 5.29 mm | - | 5.29 mm | 5.29 mm | 5.29 mm | 7.62 mm | 5.29 mm |
厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
封装等效代码 | - | DIP20,.3 | SSOP20,.3 | - | SSOP20,.3 | - | SSOP20,.3 | DIP20,.3 | - |
电源 | - | 3/5 V | 3/5 V | - | 3/3.3 V | - | 3/3.3 V | 3/3.3 V | - |
技术 | - | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | - |
Factory Lead Time | - | - | 6 weeks | - | 7 weeks | 6 weeks | 6 weeks | - | 6 weeks |
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