电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TW-02-03-G-D-330-SM

产品描述板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount
产品类别连接器    板对板与夹层连接器   
文件大小949KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

TW-02-03-G-D-330-SM在线购买

供应商 器件名称 价格 最低购买 库存  
TW-02-03-G-D-330-SM - - 点击查看 点击购买

TW-02-03-G-D-330-SM概述

板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount

TW-02-03-G-D-330-SM规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Connectors
位置数量4 Position
节距2 mm
排数2 Row
端接类型SMD/SMT
安装角Vertical
电流额定值4.9 A
系列TW
封装Bulk
应用Elevated Board Staking
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Phosphor Bronze
安装风格SMT
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度8.382 mm
工厂包装数量1

文档预览

下载PDF文档
F-219
TW–25–02–F–S–260–SM
TW–10–04–L–D–300–SM
(2.00 mm) .0787"
TW–20–07–T–D–550–SM
TW SERIES
SMT BOARD STACKERS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating:
4.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
RoHS Compliant:
Yes
Board Mates:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS
Cable Mates:
TCSD
Available with
optional
pick & place
pads
OTHER SOLUTIONS
• Stacker height
ranges and standard
part numbers on
double row.
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.15 mm) .006" max*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.00 mm)
.0787" pitch
Available
with optional
alignment pins
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
below.
(2.00)
.0787
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
SM
OTHER
OPTIONS
02 thru 36
FILE NO. E111594
= Gold flash
on post,
Matte Tin
on tail
–F
= Single
Row
–S
–“XXX”
= Stacker
Height
in inches
(0.13 mm)
.005"
increments
= Polarized Position
–“XXX”
–A
No. of positions
x (2.00) .0787
= 10 µ"
(0.25 µm)
Gold on post,
Matte Tin
on tail
–L
= Double
Row
–D
Example:
–250
= (6.35 mm)
.250"
= Alignment Pin
(Metal or plastic
at Samtec discretion)
(4.83 mm) .190" min.
board space
(–D only)
ALSO AVAILABLE
(MOQ Required)
• Other Platings
• End shrouds with or
without guide post
36
(2.00)
02
.0787
01
72
= Matte Tin
(4.00)
.1574
–T
A
(5.33)
.210
ROW
OPTION
= Pick & Place Pad
(1.91 mm) .075" min.
post height
(04-36 only)
–P
A
(5.08) .200
(6.35) .250
01
(1.27) .050 TYP
(0.00)
(0.51)
.000 MIN
.020 SQ
STACKER
HEIGHT OAL
(4.32)
.170
MIN
71
LEAD
STYLE
OAL
(7.85) .309
(11.86) .467
(12.37) .487
(15.37) .605
(17.35) .683
(9.86) .388
–S
–D
Notes:
For added mechanical
stability, Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–02
–03
–04
–06
–07
–09
–P OPTION
= Tape & Reel
Packaging
(–07 lead style
not available)
(–06 lead style with
–P option not available
as a standard)
–TR
(1.27)
.050
(1.09)
.043
DIA
(1.50)
.059
(2.00)
.0787
–A OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
[转] 丁类放大器背后的奥秘
丁类放大器背后的奥秘 作者:Eric Gaalaas音频放大器的用途是在发声输出元件上复现输入音频信号,提供所需要的音量和功率水平——保证复现的忠实性、高效率以及低失真度。在这一任务面前, ......
dontium ADI 工业技术
计算机英语词汇
A A sequential block of code 顺序代码块 Address bus 地址总线 ALU : Arithmetic Logic Unit 算术逻辑单元 API : Application Program Interface 应用程序接 ......
open82977352 聊聊、笑笑、闹闹
G2553的TB 定时器怎么用
G2553的TB 定时器怎么用...
Junson 微控制器 MCU
个人感觉超级猛的一个开发板——Spartan-6 FPGA 嵌入式套件
41615 这是官网的资料: Spartan-6 FPGA 嵌入式套件基于 Spartan-6 LX45T FPGA,该套件包含嵌入式开发所需的可扩展式开发板与主要工具和 IP。还有参考设计和软件/硬件辅导资料。如果软 ......
clark FPGA/CPLD
zigbee的hex文件烧录之后无法正常运行程序
我用SmartRF Flash Programmer给zigbee模块烧录hex文件之后(程序内容是zigbee模块的组播例程),两个模块之前无法组网,我用开发板重新试了试也不行,按下复位键也没有效果,但是用IAR在线仿真 ......
驴儿快跑 无线连接
集成主板优化攻略4项方法
集成主板通常指那些在主板上直接集成了显卡、声卡或网卡等部件的主板,其中以集成显卡为重要特征。虽然集成主板并不是主流产品,但它以较低的价格及安装的简便性还是在主板市场占有一席之地。 ......
fighting 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2208  2794  2190  2146  2616  45  57  44  53  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved