电可擦除可编程只读存储器 512x8 - 2.5V Lead Free Package
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010XXMR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.4 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 反向引出线 | NO |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| 24LC04B-I/STG | 24AA04-I-STG | 24AA04T-I-STG | 24AA04T-I-SNG | 24LC04BT-I-MSG | 24LC04B-I/MSG | 24LC04B-I/PG | 24AA04T-I/OTG | 24AA04-I/PG | 24LC04BT-I/STG | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 电可擦除可编程只读存储器 512x8 - 2.5V Lead Free Package | EEPROM 512x8 - 1.8V Lead Free Package | EEPROM 512x8 - 1.8V Lead Free Package | EEPROM 512x8 - 1.8V Lead Free Package | EEPROM 512x8 - 2.5V Lead Free Package | EEPROM 512x8 - 2.5V Lead Free Package | EEPROM 512x8 - 2.5V Lead Free Package | 电可擦除可编程只读存储器 512x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 512x8 - 1.8V Lead Free Package | 电可擦除可编程只读存储器 512x8 - 2.5V Lead Free Package |
| 是否无铅 | 不含铅 | - | - | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | - | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | - | - | - | - | MSOP | DIP | SOT-23 | DIP | SOIC |
| 包装说明 | TSSOP, TSSOP8,.25 | - | - | - | - | TSSOP, TSSOP8,.19 | DIP, DIP8,.3 | LSSOP, TSOP5/6,.11,37 | DIP, DIP8,.3 | TSSOP, TSSOP8,.25 |
| 针数 | 8 | - | - | - | - | 8 | 8 | 5 | 8 | 8 |
| Reach Compliance Code | compliant | - | - | - | - | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz | - | - | - | - | 0.4 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 200 | - | - | - | - | 200 | 200 | 200 | 200 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles | - | - | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010XXMR | - | - | - | - | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR | 1010XXMR |
| JESD-30 代码 | R-PDSO-G8 | - | - | - | - | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G5 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e3 | - | - | - | - | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.4 mm | - | - | - | - | 3 mm | 9.27 mm | 2.9 mm | 9.27 mm | 4.4 mm |
| 内存密度 | 4096 bit | - | - | - | - | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | EEPROM | - | - | - | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | - | - | - | - | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | - | - | - | - | 8 | 8 | 5 | 8 | 5 |
| 字数 | 512 words | - | - | - | - | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | - | - | - | - | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | - | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512X8 | - | - | - | - | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | - | - | - | TSSOP | DIP | LSSOP | DIP | TSSOP |
| 封装等效代码 | TSSOP8,.25 | - | - | - | - | TSSOP8,.19 | DIP8,.3 | TSOP5/6,.11,37 | DIP8,.3 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | - | - | - | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | - | - | - | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | - | - | - | - | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 |
| 电源 | 3/5 V | - | - | - | - | 3/5 V | 3/5 V | 2/5 V | 2/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 反向引出线 | NO | - | - | - | - | NO | NO | NO | NO | NO |
| 座面最大高度 | 1.2 mm | - | - | - | - | 1.1 mm | 5.33 mm | 1.45 mm | 5.33 mm | 1.2 mm |
| 串行总线类型 | I2C | - | - | - | - | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.000005 A | - | - | - | - | 0.000005 A | 0.000005 A | 0.000001 A | 0.000001 A | 0.000005 A |
| 最大压摆率 | 0.003 mA | - | - | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | - | - | - | - | 2.5 V | 2.5 V | 1.7 V | 1.7 V | 2.5 V |
| 表面贴装 | YES | - | - | - | - | YES | NO | YES | NO | YES |
| 技术 | CMOS | - | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | - | - | - | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.65 mm | - | - | - | - | 0.65 mm | 2.54 mm | 0.95 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | - | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | - | - | - | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 |
| 宽度 | 3 mm | - | - | - | - | 3 mm | 7.62 mm | 1.55 mm | 7.62 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | - | - | - | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | - | - | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | 1 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
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