NXP Semiconductors
Data Sheet: Technical Data
MKW36A512
Rev. 6, 09/2018
MKW36A/35A Data Sheet
An ultra low power, highly integrated Bluetooth® Low
Energy wireless microcontroller
MKW36A512VHT4
MKW36A512VFP4
MKW35A512VFP4
48 LQFN
7x7 mm Pitch 0.5 mm
40 "Wettable" QFN
6x6 mm Pitch 0.5 mm
Multi-Standard Radio
System peripherals
• 2.4 GHz Bluetooth Low Energy version 5.0 compliant
• Nine MCU low-power modes to provide power
supporting up to 8 simultaneous hardware connections
optimization based on application requirements
• Generic FSK modulation
• DC-DC Converter supporting Buck and Bypass
• Data Rate: 250, 500 and 1000 kbps
operating modes
• Modulations: GFSK BT = 0.3, 0.5, and 0.7;
• Direct memory access (DMA) Controller
FSK/MSK
• Computer operating properly (COP) watchdog
• Modulation Index: 0.32, 0.5, 0.7, and 1.0
• Serial wire debug (SWD) Interface and Micro Trace
• Typical Receiver Sensitivity (BLE 1 Mbps) = -95 dBm
buffer
• Typical Receiver Sensitivity (250 kbps GFSK-BT=0.5,
• Bit Manipulation Engine (BME)
h=0.5) = -99 dBm
• Programmable Transmitter Output Power: -30 dBm to
Analog Modules
• 16-bit Analog-to-Digital Converter (ADC)
+3.5 dBm
• 6-bit High Speed Analog Comparator (CMP)
• Low external component counts for low cost application
• 1.2 V voltage reference (VREF)
• On-chip balun with single ended bidirectional RF port
MCU and Memories
• 256 KB program flash memory plus 256 KB FlexNVM
on KW36A
• 8 KB FlexRAM supporting EEPROM emulation on
KW36A
• 512 KB program flash memory on KW35A
• Up to 48 MHz Arm® Cortex®-M0+ core
• On-chip 64 KB SRAM
Timers
• 16-bit low-power timer (LPTMR)
• 3 Timer/PWM Modules(TPM): One 4 channel TPM
and two 2 channel TPMs
• Programmable Interrupt Timer (PIT)
• Real-Time Clock (RTC)
Communication interfaces
• 2 serial peripheral interface (SPI) modules
• 2 inter-integrated circuit (I2C) modules
Low Power Consumption
• Low Power UART (LPUART) module with LIN
• Transceiver current (DC-DC buck mode, 3.6 V supply)
support (2x LPUART on KW36A)
• Typical Rx Current: 6.3 mA
• Carrier Modulator Timer (CMT)
• Typical Tx current: 5.7 mA (0 dBm output)
• FlexCAN module (with CAN FD support up to 3.2
• Low Power Mode (VLLS0) Current: 258 nA
Mbps baudrate) on KW36A
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Clocks
• 26 and 32 MHz supported for BLE and Generic FSK
modes
• 32.768 kHz Crystal Oscillator
Operating Characteristics
• Voltage range: 1.71 V to 3.6 V
• Ambient temperature range: –40 to 105 °C
• AEC Q100 Grade 2 Automotive Qualification
Human-machine interface
• General-purpose input/output
Security
• AES-128 Hardware Accelerator (AESA)
• True Random Number Generator (TRNG)
• Advanced flash security on Program Flash
• 80-bit unique identification number per chip
• 40-bit unique media access control (MAC) sub-
address
• LE Secure Connections
Orderable parts details
Device
MKW36A512VHT4
MKW36A512VFP4
MKW35A512VFP4
Qualification
Auto
Auto
Auto
CAN FD
Y
Y
N
2
nd
UART with LIN
Y
Y
N
FlexRAM
Y
Y
N
Package
7X7 mm 48-pin
LQFN
6X6 mm 40-pin
"Wettable" QFN
6X6 mm 40-pin
"Wettable" QFN
Related Resources
Type
Product
Selector
Fact Sheet
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
The Product Selector lets you find the right Kinetis part for your design.
The Fact Sheet gives overview of the product key features and its uses.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Resource
W-Series Product Selector
KW36-35 Fact Sheet
MKW36A512RM
1
This document.
The chip mask set Errata provides additional or corrective information for KINETIS_W_N41U
1
a particular device mask set.
Package dimensions are provided in package drawings.
• 40-pin "Wettable" QFN
(6x6): 98ASA01025D
1
• 48-pin LQFN (7x7):
98ASA00694D
1
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
2
NXP Semiconductors
MKW36A/35A Data Sheet, Rev. 6, 09/2018
Table of Contents
1 Introduction........................................................................... 4
2 Feature Descriptions............................................................. 5
2.1 Block Diagram............................................................... 5
2.2 Radio features............................................................... 6
2.3 Microcontroller features................................................. 6
2.4 System features............................................................. 8
2.5 Peripheral features........................................................ 10
2.6 Security Features...........................................................14
Transceiver Description........................................................ 16
3.1 Key Specifications......................................................... 16
3.2 Channel Map Frequency Plans .................................... 17
3.2.1 Channel Plan for Bluetooth Low Energy............ 17
3.2.2 Other Channel Plans .........................................18
3.3 Transceiver Functions................................................... 19
Transceiver Electrical Characteristics................................... 19
4.1 Radio operating conditions............................................ 19
4.2 Receiver Feature Summary........................................... 20
4.3 Transmit and PLL Feature Summary.............................22
System and Power Management.......................................... 25
5.1 Power Management.......................................................25
5.1.1 DC-DC Converter...............................................26
5.2 Modes of Operation....................................................... 26
5.2.1 Power modes..................................................... 26
KW36A/35A Electrical Characteristics.................................. 29
6.1 AC electrical characteristics...........................................29
6.2 Nonswitching electrical specifications............................29
6.2.1 Voltage and current operating requirements......29
6.2.2 LVD and POR operating requirements.............. 30
6.2.3 Voltage and current operating behaviors........... 31
6.2.4 Power mode transition operating behaviors.......32
6.2.5 Power consumption operating behaviors...........33
6.2.6 Diagram: Typical IDD_RUN operating behavior 39
6.2.7 SoC Power Consumption...................................41
6.2.8 Designing with radiated emissions in mind........ 42
6.2.9 Capacitance attributes....................................... 42
6.3 Switching electrical specifications..................................42
6.3.1 Device clock specifications................................ 42
6.3.2 General switching specifications........................43
6.4 Thermal specifications................................................... 44
6.4.1
6.4.2
Thermal operating requirements........................44
Thermal attributes.............................................. 44
6.5 Peripheral operating requirements and behaviors......... 45
6.5.1 Core modules.....................................................45
6.5.2 System modules................................................ 46
6.5.3 Clock modules................................................... 47
6.5.4 Memories and memory interfaces......................50
6.5.5 Security and integrity modules...........................53
6.5.6 Analog................................................................54
6.5.7 Timers................................................................ 61
6.5.8 Communication interfaces................................. 61
6.5.9 Human-machine interfaces (HMI)...................... 66
6.6 DC-DC Converter Operating Requirements.................. 66
6.7 Ratings...........................................................................68
6.7.1 Thermal handling ratings................................... 68
6.7.2 Moisture handling ratings...................................68
6.7.3 ESD handling ratings......................................... 68
6.7.4 Voltage and current operating ratings................69
7 Pin Diagrams and Pin Assignments......................................69
7.1 KW36A Signal Multiplexing and Pin Assignments......... 69
7.2 KW36A Pinouts..............................................................72
7.3 KW35A Signal Multiplexing and Pin Assignments......... 74
7.4 KW35A Pinouts..............................................................76
7.5 Module Signal Description Tables................................. 77
7.5.1 Core Modules.....................................................77
7.5.2 Radio Modules................................................... 78
7.5.3 System Modules................................................ 79
7.5.4 Clock Modules................................................... 80
7.5.5 Analog Modules................................................. 80
7.5.6 Timer Modules................................................... 81
7.5.7 Communication Interfaces................................. 82
7.5.8 Human-Machine Interfaces(HMI).......................83
8 Package Information............................................................. 84
8.1 Obtaining package dimensions......................................84
9 Part identification...................................................................84
9.1 Description..................................................................... 84
9.2 Format........................................................................... 84
9.3 Fields............................................................................. 84
9.4 Example......................................................................... 85
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MKW36A/35A Data Sheet, Rev. 6, 09/2018
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NXP Semiconductors
Introduction
1 Introduction
The KW36A/35A wireless microcontrollers (MCU), which includes the KW36A and
KW35A families of devices, are highly integrated single-chip devices that enable
Bluetooth Low Energy (BLE) and Generic FSK connectivity for automotive embedded
systems. To meet the stringent requirements of automotive applications, the
KW36A/35A is fully AEC Q100 Grade 2 Automotive Qualified. The target applications
center on wirelessly bridging the embedded world with mobile devices to enhance the
human interface experience, share embedded data between devices and the cloud and
enable wireless firmware updates. Leading the automotive applications is the Digital
Key, where a smartphone can be used by the owner as an alternative to the key FOB for
unlocking and personalizing the driving experience. For a car sharing experience, the
owner can provide selective, temporary authorization for access to the car allowing the
authorized person to unlock, start and operate the car using their mobile device using
BLE.
The KW36A/35A Wireless MCU integrates an Arm® Cortex®-M0+ CPU with up to
512 KB flash and 64 KB SRAM and a 2.4 GHz radio that supports BLE 5.0 and
Generic FSK modulations. The BLE radio supports up to 8 simultaneous connections in
any master/slave combination. The Medical Body Area Network (MBAN) frequencies
from 2.36 to 2.4 GHz are also supported enabling wearable or implantable wireless
medical devices.
The KW36A includes an integrated FlexCAN module enabling seamless integration
into a cars in-vehicle CAN communication network. The FlexCAN module can support
CAN’s flexible data-rate (CAN FD) protocol for increased bandwidth and lower latency
required by many automotive applications.
The KW36A/35A devices can be used as a "BlackBox" modem in order to add BLE or
Generic FSK connectivity to an existing host MCU or MPU (microprocessor), or may
be used as a standalone smart wireless sensor with embedded application where no host
controller is required.
The RF circuit of the KW36A/35A is optimized to require very few external
components, achieving the smallest RF footprint possible on a printed circuit board.
Extremely long battery life is achieved through the efficiency of code execution in the
Cortex-M0+ CPU core and the multiple low power operating modes of the KW36A/
35A. For power critical applications, an integrated DC-DC converter enables operation
from a single coin cell or Li-ion battery with a significant reduction of peak receive and
transmit current consumption.
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NXP Semiconductors
MKW36A/35A Data Sheet, Rev. 6, 09/2018
Feature Descriptions
2 Feature Descriptions
This section provides a simplified block diagram and highlights the KW36A/35A
features.
2.1 Block Diagram
Arm Cortex M0+ Core
Serial Wire Debug
DAP
MDM
NVIC
IOPORT
WIC
DMA MUX
MCG
IRC
4 MHz
IRC
32 kHz
32K Osc
32M Osc
DWT
MTB
Unified Bus
AHBLite
M0
4ch DMA
AHBLite
M2A
FLL
Crossbar-Lite Switch (AXBS)
S1
S0
S2
64 KByte
SRAM
Flash
Controller
Flash
256 KB
FlexNVM
256 KB
FlexRAM
8 KB
SIM
ADC
GPIO
LTC(AESA)
PIT
I2C x2
BME
SMC
CMP
TPM x3
LPUART x2
AIPS-Lite
RCM
TRNG
LPTMR
SPI x2
Radio
APB
IPS
IPS
VDCDC_IN
DCDC
PMC
VREF
RTC
CMT
FlexCAN
Figure 1. KW36 Detailed Block Diagram
Arm Cortex M0+ Core
Serial Wire Debug
DAP
MDM
NVIC
IOPORT
WIC
DMA MUX
MCG
IRC
4 MHz
IRC
32 kHz
32K Osc
32M Osc
DWT
MTB
Unified Bus
AHBLite
M0
4ch DMA
AHBLite
M2A
FLL
Crossbar-Lite Switch (AXBS)
S1
S0
S2
64 KByte
SRAM
Flash
Controller
Flash
512 KB
Prg Acc RAM
SIM
ADC
GPIO
PIT
I2C x2
BME
SMC
CMP
LTC(AESA)
TPM x3
LPUART
AIPS-Lite
8 KB
VDCDC_IN
RCM
TRNG
LPTMR
SPI x2
Radio
IPS
DCDC
PMC
VREF
RTC
CMT
IPS
APB
Figure 2. KW35 Detailed Block Diagram
MKW36A/35A Data Sheet, Rev. 6, 09/2018
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NXP Semiconductors
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