数模转换器- DAC 5th-Order 5V Lowpass Butter S-Cap Filtr
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e3 |
| 长度 | 26.16 mm |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MAX7645BEPP+ | MX7545AKEWP+ | MX7545AKN+ | MAX7645BCWP+ | MAX7645ACPP+ | MX7545AKCWP+ | |
|---|---|---|---|---|---|---|
| 描述 | 数模转换器- DAC 5th-Order 5V Lowpass Butter S-Cap Filtr | 数模转换器- DAC 12-Bit Precision DAC | 数模转换器- DAC 12-Bit Precision DAC | 数模转换器- DAC 12-Bit Buffered DAC | 数模转换器- DAC 12-Bit Buffered DAC | 数模转换器- DAC 12-Bit Precision DAC |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | SOIC | DIP | SOIC | DIP | SOIC |
| 包装说明 | DIP, | SOP, | DIP, | 0.300 INCH, SO-20 | DIP, DIP20,.3 | SOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 26.16 mm | 12.8 mm | 26.16 mm | 12.8 mm | 26.16 mm | 12.8 mm |
| 最大线性误差 (EL) | 0.0244% | 0.0122% | 0.0122% | 0.0244% | 0.0122% | 0.0122% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 2.65 mm | 4.572 mm | 2.65 mm | 4.572 mm | 2.65 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | - | 13 weeks | 13 weeks | - | 6 weeks | 13 weeks |
| 最大压摆率 | - | 2 mA | - | 2 mA | 2 mA | 2 mA |
Microchip MCU
ARM技术
FPGA/CPLD
汽车电子
FPGA/CPLD
无线连接
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
