静态随机存取存储器 2.5 or 3.3V 256K x 32 8M
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | GSI Technology |
零件包装代码 | QFP |
包装说明 | LQFP, QFP100,.63X.87 |
针数 | 100 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.2.B |
Factory Lead Time | 8 weeks |
最长访问时间 | 6.5 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY |
最大时钟频率 (fCLK) | 153 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e3 |
长度 | 20 mm |
内存密度 | 8388608 bit |
内存集成电路类型 | CACHE SRAM |
内存宽度 | 32 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX32 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装等效代码 | QFP100,.63X.87 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大待机电流 | 0.025 A |
最小待机电流 | 2.3 V |
最大压摆率 | 0.14 mA |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | PURE MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
GS880F32CGT-6.5 | GS880F18CGT-4.5 | GS880F36CGT-5.5 | GS880F36CGT-5 | GS880F32CGT-5.5 | GS880F36CGT-6.5 | GS880F32CGT-5 | GS880F18CGT-5.5 | GS880F32CGT-4.5 | GS880F32CGT-7.5 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 静态随机存取存储器 2.5 or 3.3V 256K x 32 8M | SRAM 2.5 or 3.3V 512K x 18 9M | SRAM 2.5 or 3.3V 256K x 36 9M | SRAM 2.5 or 3.3V 256K x 36 9M | SRAM 2.5 or 3.3V 256K x 32 8M | SRAM 2.5 or 3.3V 256K x 36 9M | SRAM 2.5 or 3.3V 256K x 32 8M | SRAM 2.5 or 3.3V 512K x 18 9M | SRAM 2.5 or 3.3V 256K x 32 8M | SRAM 2.5 or 3.3V 256K x 32 8M |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | - | GSI Technology | GSI Technology | GSI Technology |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | - | QFP | QFP | QFP |
包装说明 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | - | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
Factory Lead Time | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | 8 weeks | - | 8 weeks | 8 weeks | 8 weeks |
最长访问时间 | 6.5 ns | 4.5 ns | 5.5 ns | 5 ns | 5.5 ns | 6.5 ns | - | 5.5 ns | 4.5 ns | 7.5 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | - | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY |
最大时钟频率 (fCLK) | 153 MHz | 222 MHz | 182 MHz | 200 MHz | 182 MHz | 153 MHz | - | 182 MHz | 222 MHz | 133 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | - | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | - | e3 | e3 | e3 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | - | 20 mm | 20 mm | 20 mm |
内存密度 | 8388608 bit | 9437184 bit | 9437184 bit | 9437184 bit | 8388608 bit | 9437184 bit | - | 9437184 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | - | CACHE SRAM | CACHE SRAM | CACHE SRAM |
内存宽度 | 32 | 18 | 36 | 36 | 32 | 36 | - | 18 | 32 | 32 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | - | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 |
字数 | 262144 words | 524288 words | 262144 words | 262144 words | 262144 words | 262144 words | - | 524288 words | 262144 words | 262144 words |
字数代码 | 256000 | 512000 | 256000 | 256000 | 256000 | 256000 | - | 512000 | 256000 | 256000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
组织 | 256KX32 | 512KX18 | 256KX36 | 256KX36 | 256KX32 | 256KX36 | - | 512KX18 | 256KX32 | 256KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | - | LQFP | LQFP | LQFP |
封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | - | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | - | 260 | 260 | 260 |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | - | 0.025 A | 0.025 A | 0.025 A |
最小待机电流 | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
最大压摆率 | 0.14 mA | 0.165 mA | 0.155 mA | 0.165 mA | 0.155 mA | 0.14 mA | - | 0.145 mA | 0.18 mA | 0.13 mA |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | - | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | PURE MATTE TIN | PURE MATTE TIN | PURE MATTE TIN | PURE MATTE TIN | PURE MATTE TIN | PURE MATTE TIN | - | PURE MATTE TIN | PURE MATTE TIN | PURE MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | - | 14 mm | 14 mm | 14 mm |
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