静态随机存取存储器 1.8 or 1.5V 8M x 18 144M
| 参数名称 | 属性值 |
| 厂商名称 | GSI Technology |
| 产品种类 | 静态随机存取存储器 |
| 存储容量 | 144 Mbit |
| 组织 | 8 M x 18 |
| 最大时钟频率 | 400 MHz |
| 接口类型 | Parallel |
| 电源电压-最大 | 1.9 V |
| 电源电压-最小 | 1.7 V |
| 电源电流—最大值 | 1.055 A |
| 最小工作温度 | 0 C |
| 最大工作温度 | + 70 C |
| 安装风格 | SMD/SMT |
| 封装 / 箱体 | BGA-165 |
| 封装 | Tray |
| 存储类型 | QDR-II |
| 系列 | GS81302DT19GE |
| 类型 | SigmaQuad-II+ B4 |
| 工厂包装数量 | 10 |
| GS81302DT19GE-400 | GS81302DT19GE-300 | GS81302DT37GE-300I | GS81302DT19E-333I | GS81302DT10E-350 | GS81302DT19GE-400I | GS81302DT19GE-350I | GS81302DT10GE-450I | GS81302DT10GE-450 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 静态随机存取存储器 1.8 or 1.5V 8M x 18 144M | 静态随机存取存储器 1.8 or 1.5V 8M x 18 144M | 静态随机存取存储器 1.8 or 1.5V 4M x 36 144M | 静态随机存取存储器 1.8 or 1.5V 8M x 18 144M | 静态随机存取存储器 1.8 or 1.5V 16M x 9 144M | 静态随机存取存储器 1.8 or 1.5V 8M x 18 144M | 静态随机存取存储器 1.8 or 1.5V 8M x 18 144M | 静态随机存取存储器 1.8 or 1.5V 16M x 9 144M | 静态随机存取存储器 1.8 or 1.5V 16M x 9 144M |
| 厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
| 组织 | 8 M x 18 | 8MX18 | 4MX36 | 8MX18 | 16MX9 | 8MX18 | 8MX18 | 16MX9 | 16MX9 |
| 是否无铅 | - | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | - | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
| 针数 | - | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Factory Lead Time | - | 12 weeks | 12 weeks | 12 weeks | 12 weeks | 12 weeks | 12 weeks | 12 weeks | 12 weeks |
| 最长访问时间 | - | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns |
| 其他特性 | - | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| JESD-30 代码 | - | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
| JESD-609代码 | - | e1 | e1 | - | - | e1 | e1 | e1 | e1 |
| 长度 | - | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
| 内存密度 | - | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit | 150994944 bit |
| 内存集成电路类型 | - | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM |
| 内存宽度 | - | 18 | 36 | 18 | 9 | 18 | 18 | 9 | 9 |
| 湿度敏感等级 | - | 3 | 3 | - | - | 3 | 3 | 3 | 3 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| 字数 | - | 8388608 words | 4194304 words | 8388608 words | 16777216 words | 8388608 words | 8388608 words | 16777216 words | 16777216 words |
| 字数代码 | - | 8000000 | 4000000 | 8000000 | 16000000 | 8000000 | 8000000 | 16000000 | 16000000 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | - | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | 260 |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm |
| 最大供电电压 (Vsup) | - | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
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