热交换电压控制器 LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PQCC-N24 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4 mm |
| LTC4261IUFD-2#TR | LTC4261IGN | LTC4261IGN-2#TR | LTC4261CUFD#TR | LTC4261IUFD | LTC4261IGN-2#PBF | LTC4261IGN#TR | LTC4261CGN-2#TR | LTC4261IUFD#TR | LTC4261CGN#TR | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 热交换电压控制器 LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers 48V SWAP CONTROLLER WITH I2C ADC | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | 热交换电压控制器 LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | HVQCCN, | 0.150 INCH, PLASTIC, SSOP-28 | SSOP, | HVQCCN, | 4 X 5 MM, PLASTIC, QFN-24 | SSOP, | SSOP, | SSOP, | HVQCCN, | SSOP, |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PQCC-N24 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-N24 | R-PQCC-N24 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-N24 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e3 | e0 | e0 | e0 | e0 |
| 长度 | 5 mm | 9.893 mm | 9.893 mm | 5 mm | 5 mm | 9.893 mm | 9.893 mm | 9.893 mm | 5 mm | 9.893 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 28 | 28 | 24 | 24 | 28 | 28 | 28 | 24 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SSOP | SSOP | HVQCCN | HVQCCN | SSOP | SSOP | SSOP | HVQCCN | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | 235 | 235 | 260 | 235 | 235 | 235 | 235 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.75 mm | 1.75 mm | 0.8 mm | 0.8 mm | 1.75 mm | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 30 | 20 | 20 | 20 | 20 |
| 宽度 | 4 mm | 3.899 mm | 3.899 mm | 4 mm | 4 mm | 3.899 mm | 3.899 mm | 3.899 mm | 4 mm | 3.899 mm |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | - | IT ALSO OPERATES WITH -12V TO -100V | - | IT ALSO OPERATES WITH -12V TO -100V | IT ALSO OPERATES WITH -12V TO -100V | - | IT ALSO OPERATES WITH -12V TO -100V | - | IT ALSO OPERATES WITH -12V TO -100V | IT ALSO OPERATES WITH -12V TO -100V |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
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