Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
包装说明 | SSOP, |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 9.893 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 235 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 3.899 mm |
LTC4261CGN-2#TR | LTC4261IGN | LTC4261IGN-2#TR | LTC4261CUFD#TR | LTC4261IUFD | LTC4261IGN-2#PBF | LTC4261IGN#TR | LTC4261IUFD#TR | LTC4261CGN#TR | LTC4261IUFD-2#TR | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers 48V SWAP CONTROLLER WITH I2C ADC | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | Hot Swap Voltage Controllers LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | 热交换电压控制器 LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring | 热交换电压控制器 LTC4261 - Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
包装说明 | SSOP, | 0.150 INCH, PLASTIC, SSOP-28 | SSOP, | HVQCCN, | 4 X 5 MM, PLASTIC, QFN-24 | SSOP, | SSOP, | HVQCCN, | SSOP, | HVQCCN, |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
可调阈值 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-N24 | R-PQCC-N24 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-N24 | R-PDSO-G28 | R-PQCC-N24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e3 | e0 | e0 | e0 | e0 |
长度 | 9.893 mm | 9.893 mm | 9.893 mm | 5 mm | 5 mm | 9.893 mm | 9.893 mm | 5 mm | 9.893 mm | 5 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 24 | 24 | 28 | 28 | 24 | 28 | 24 |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | SSOP | HVQCCN | HVQCCN | SSOP | SSOP | HVQCCN | SSOP | HVQCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 235 | 235 | 235 | 235 | 235 | 260 | 235 | 235 | 235 | 235 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 0.8 mm | 0.8 mm | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm | 0.8 mm |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 30 | 20 | 20 | 20 | 20 |
宽度 | 3.899 mm | 3.899 mm | 3.899 mm | 4 mm | 4 mm | 3.899 mm | 3.899 mm | 4 mm | 3.899 mm | 4 mm |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | - | IT ALSO OPERATES WITH -12V TO -100V | - | IT ALSO OPERATES WITH -12V TO -100V | IT ALSO OPERATES WITH -12V TO -100V | - | IT ALSO OPERATES WITH -12V TO -100V | IT ALSO OPERATES WITH -12V TO -100V | IT ALSO OPERATES WITH -12V TO -100V | - |
技术 | - | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
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