电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MRC1/21003600FLF

产品描述MELF电阻器
产品类别无源元件    电阻器    MELF电阻器   
文件大小248KB,共3页
制造商Welwyn Components (TT Electronics)
下载文档 详细参数 全文预览

MRC1/21003600FLF概述

MELF电阻器

MRC1/21003600FLF规格参数

参数名称属性值
厂商名称Welwyn Components (TT Electronics)
产品种类MELF电阻器
系列MRC
封装Reel
安装风格PCB Mount
工厂包装数量2500

文档预览

下载PDF文档
Resistors
Metal Glaze™ High Power Density
Surface Mount Power Resistor
MRC Series
Metal Glaze High
Power
Density
MRC Series
Surface
Mount
Power
Resistor
TM
1/2 watt in 1/8 watt package
MRC1/2: 0.05 Ω to 1.0 Ω (contact factory for higher values)
1/2
watt
in 1/8
watt
package
150°C maximum operating temperature
1
watt
in 1/2
watt
package (2010
footprint)
Superior surge handling capability
MRC1/2:
0.05
to 1.0
(contact
factory for
higher
values)
RoHS compliant Versions available
150°C maximum operating temperature
Superior surge handling capability
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
60/40 Solder
over
nickel barrier
Electrical Data
Size
Industry
Code
1
Footprint
IRC
Type
Max.
Power Rating
Working
Voltage
2
Max.
Resistance
TCR
Tolerance
Voltage Range (ohms)
3
(ppm/°C)
3
(±%)
3
0.1 to 0.99
C
1206
MRC1/2
1/2W @ 70°C
200
400
1.0 to 10K
20 to 10K
1,2,5
1,2,5
0.25, 0.5
100
50,100
50,100
Product
Catagory
Low
Range
Standard
Tight
Tolerance
MRC Applications:
The
MRC1/2
will dissipate
1/2 watt at
70°C on
a
1206
footprint.
The
MRC
is recommended
for
applications where
board
real estate
is
a
major concern. Due
to
high power density and superior
surge
handling capability, it is
also
recommended
as a
direct replacement on
existing
board designs where standard 1206 resistors are marginal or
failing.
Environmental
Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specifi
ed
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
Test Method
MIL-R-55342E
Par
4.7.9 (-55°C + 125°C)
MIL-R-55342E
Par
4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E
Par
4.7.4 (-65°C @
working voltage)
MIL-R-55342E
Par
4.7.5
2.5 x
PxR
for
5 seconds
MIL-R-55342E
Par
4.7.6 (+150°C
for
100 hours)
MIL-R-55342E
Par
4.7.7
(Refl
ow
soldered to board at 260°C
for
10 seconds)
MIL-STD-202, Method 208 (245°C
for
5 seconds)
MIL-R-55342E
Par
4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E
Par
4.7.10 (2000 hours @ 70°C intermittent)
1200
gram
push from underside of mounted chip
for
60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to
exert
pull on chip contacts
for
10 seconds
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
06.18

推荐资源

热门文章更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2142  2651  762  2857  635  44  54  16  58  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved