500-mA 1-cell linear charger with 10-nA IQ, power path, regulated system voltage, 16-bit ADC and LDO 20-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DSBGA-20 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 8 weeks |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-XBGA-B20 |
| JESD-609代码 | e1 |
| 长度 | 2.015 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 3.15 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 宽度 | 1.615 mm |
| Base Number Matches | 1 |
| BQ25155YFPT | BQ25155 | BQ25155YFPR | |
|---|---|---|---|
| 描述 | 500-mA 1-cell linear charger with 10-nA IQ, power path, regulated system voltage, 16-bit ADC and LDO 20-DSBGA -40 to 85 | 500-mA 1-cell linear charger with 10-nA IQ, power path, regulated system voltage, 16-bit ADC and LDO 20-DSBGA -40 to 85 | 500-mA 1-cell linear charger with 10-nA IQ, power path, regulated system voltage, 16-bit ADC and LDO 20-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 |
| 包装说明 | DSBGA-20 | - | VFBGA, |
| Reach Compliance Code | compliant | - | compliant |
| 可调阈值 | YES | - | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-XBGA-B20 | - | R-PBGA-B20 |
| JESD-609代码 | e1 | - | e1 |
| 长度 | 2.015 mm | - | 2.015 mm |
| 湿度敏感等级 | 1 | - | 1 |
| 信道数量 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 20 | - | 20 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | VFBGA |
| 封装形状 | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.5 mm | - | 0.5 mm |
| 最大供电电压 (Vsup) | 5.25 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 3.15 V | - | 3.4 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V |
| 表面贴装 | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | TIN SILVER COPPER |
| 端子形式 | BALL | - | BALL |
| 端子节距 | 0.4 mm | - | 0.4 mm |
| 端子位置 | BOTTOM | - | BOTTOM |
| 宽度 | 1.615 mm | - | 1.615 mm |
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