5-V, low-leakage-current, 1:1 (SPST) precision switch 5-SOT-23 -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | SPST |
| 标称带宽 | 300 MHz |
| JESD-30 代码 | R-PDSO-G6 |
| JESD-609代码 | e4 |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 标称断态隔离度 | 40 dB |
| 通态电阻匹配规范 | 0.4 Ω |
| 最大通态电阻 (Ron) | 80 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 最大供电电流 (Isup) | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.08 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 最长断开时间 | 44 ns |
| 最长接通时间 | 44 ns |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| TMUX1101DBVR | PTMUX1101DCKR | TMUX1101 | TMUX1101DCKR | TMUX1102 | TMUX1102DBVR | TMUX1102DCKR | |
|---|---|---|---|---|---|---|---|
| 描述 | 5-V, low-leakage-current, 1:1 (SPST) precision switch 5-SOT-23 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switch 5-SC70 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switch 5-SC70 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switch 5-SC70 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switches 5-SOT-23 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switches 5-SOT-23 -40 to 125 | 5-V, low-leakage-current, 1:1 (SPST) precision switches 5-SC70 -40 to 125 |
| Brand Name | Texas Instruments | - | - | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | - | - | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | - | 符合 | 符合 |
| 包装说明 | SOP, | - | - | SOP, | - | LSSOP, | TSSOP, |
| Reach Compliance Code | compliant | - | - | compliant | - | compliant | compliant |
| Factory Lead Time | 6 weeks | - | - | 6 weeks | - | 6 weeks | 6 weeks |
| 模拟集成电路 - 其他类型 | SPST | - | - | SPST | - | SPST | SPST |
| 标称带宽 | 300 MHz | - | - | 300 MHz | - | 300 MHz | 300 MHz |
| JESD-30 代码 | R-PDSO-G6 | - | - | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | e4 | - | - | e4 | - | e4 | e4 |
| 湿度敏感等级 | 1 | - | - | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | - | 1 | - | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | - | 1 | 1 |
| 端子数量 | 6 | - | - | 5 | - | 6 | 5 |
| 标称断态隔离度 | 40 dB | - | - | 40 dB | - | 40 dB | 40 dB |
| 通态电阻匹配规范 | 0.4 Ω | - | - | 0.4 Ω | - | 0.4 Ω | 0.4 Ω |
| 最大通态电阻 (Ron) | 80 Ω | - | - | 80 Ω | - | 80 Ω | 80 Ω |
| 最高工作温度 | 125 °C | - | - | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | - | - | SOP | - | LSSOP | TSSOP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | - | SMALL OUTLINE | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 最大供电电压 (Vsup) | 5.5 V | - | - | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.08 V | - | - | 1.08 V | - | 1.08 V | 1.08 V |
| 标称供电电压 (Vsup) | 1.8 V | - | - | 1.8 V | - | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | - | YES | - | YES | YES |
| 最长断开时间 | 44 ns | - | - | 44 ns | - | 44 ns | 44 ns |
| 最长接通时间 | 44 ns | - | - | 44 ns | - | 44 ns | 44 ns |
| 技术 | CMOS | - | - | CMOS | - | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | - | - | GULL WING | - | GULL WING | GULL WING |
| 端子位置 | DUAL | - | - | DUAL | - | DUAL | DUAL |
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