IC MCU 32BIT 1MB FLASH 256LBGA
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA256,16X16,40 |
| 针数 | 256 |
| 制造商包装代码 | SOT740-2 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| CPU系列 | CORTEX-M3 |
| 最大时钟频率 | 25 MHz |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e8 |
| 长度 | 17 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 164 |
| 端子数量 | 256 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA256,16X16,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 电源 | 2.5/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 139264 |
| ROM（单词） | 1048576 |
| ROM可编程性 | FLASH |
| 速度 | 180 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2.2 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 宽度 | 17 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| LPC1837FET256,551 | 935308813551 | LPC1853FET256,551 | LPC1837JET256,551 | LPC1857JET256,551 | LPC1857FET256,551 | PRA100C8-264RBWG | LPC1817JET100,551 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC MCU 32BIT 1MB FLASH 256LBGA | RISC Microcontroller | IC MCU 32BIT 512KB FLASH 256LBGA | IC MCU 32BIT 1MB FLASH 256LBGA | IC MCU 32BIT 1MB FLASH 256LBGA | IC MCU 32BIT 1MB FLASH 256LBGA | Array/Network Resistor, Bussed, Thin Film, 0.1W, 264ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 3206, | RISC Microcontroller, 32-Bit, FLASH, CMOS, PBGA100 |
| 包装说明 | BGA, BGA256,16X16,40 | , | LBGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | LBGA, BGA256,16X16,40 | SMT, 3206 | TFBGA-100 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant | unknown |
| Brand Name | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - | - |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | BGA | - | BGA | BGA | BGA | BGA | - | - |
| 针数 | 256 | - | 256 | 256 | 256 | 256 | - | - |
| 制造商包装代码 | SOT740-2 | - | SOT740-2 | SOT740-2 | SOT740-2 | SOT740-2 | - | - |
| 具有ADC | YES | - | YES | YES | YES | YES | - | YES |
| 位大小 | 32 | - | 32 | 32 | 32 | 32 | - | 32 |
| CPU系列 | CORTEX-M3 | - | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 | CORTEX-M3 | - | - |
| 最大时钟频率 | 25 MHz | - | 25 MHz | 25 MHz | 25 MHz | 25 MHz | - | 25 MHz |
| DMA 通道 | YES | - | YES | YES | YES | YES | - | YES |
| JESD-30 代码 | S-PBGA-B256 | - | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | - | S-PBGA-B100 |
| JESD-609代码 | e8 | - | e1 | e1 | e1 | e1 | e4 | - |
| 长度 | 17 mm | - | 17 mm | 17 mm | 17 mm | 17 mm | - | 9 mm |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 | - | - |
| I/O 线路数量 | 164 | - | 164 | 164 | 164 | 164 | - | 49 |
| 端子数量 | 256 | - | 256 | 256 | 256 | 256 | 16 | 100 |
| 最高工作温度 | 85 °C | - | 85 °C | 105 °C | 105 °C | 85 °C | 155 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | - |
| PWM 通道 | YES | - | YES | YES | YES | YES | - | NO |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | BGA | - | LBGA | BGA | BGA | LBGA | - | TFBGA |
| 封装等效代码 | BGA256,16X16,40 | - | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | - | - |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | GRID ARRAY | - | GRID ARRAY, LOW PROFILE | GRID ARRAY | GRID ARRAY | GRID ARRAY, LOW PROFILE | SMT | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 电源 | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| RAM（字节） | 139264 | - | 139264 | 139264 | 139264 | 139264 | - | - |
| ROM（单词） | 1048576 | - | 524288 | 1048576 | 1048576 | 1048576 | - | - |
| ROM可编程性 | FLASH | - | FLASH | FLASH | FLASH | FLASH | - | FLASH |
| 速度 | 180 MHz | - | 180 MHz | 180 MHz | 180 MHz | 180 MHz | - | 180 MHz |
| 最大供电电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 | 2.2 V | - | 2.2 V | 2.2 V | 2.2 V | 2.2 V | - | 3 V |
| 标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | THIN FILM | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Gold (Au) - with Nickel (Ni) barrier | - |
| 端子形式 | BALL | - | BALL | BALL | BALL | BALL | - | BALL |
| 端子节距 | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm | - | 0.8 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM |
| 宽度 | 17 mm | - | 17 mm | 17 mm | 17 mm | 17 mm | - | 9 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
嵌入式系统
微控制器 MCU
模拟与混合信号
stm32/stm8
Microchip MCU
电源技术
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
