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PTFA092211FLV4R250XTMA1

产品描述IC FET RF LDMOS
产品类别分立半导体    晶体管   
文件大小418KB,共10页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
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PTFA092211FLV4R250XTMA1概述

IC FET RF LDMOS

PTFA092211FLV4R250XTMA1规格参数

参数名称属性值
厂商名称Infineon(英飞凌)
包装说明FLATPACK, R-XDFP-F2
Reach Compliance Codeunknown
其他特性HGH RELIABILITY
外壳连接SOURCE
配置SINGLE
最小漏源击穿电压65 V
FET 技术METAL-OXIDE SEMICONDUCTOR
最高频带ULTRA HIGH FREQUENCY BAND
JESD-30 代码R-XDFP-F2
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度200 °C
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式FLATPACK
极性/信道类型N-CHANNEL
表面贴装YES
端子形式FLAT
端子位置DUAL
晶体管应用AMPLIFIER
晶体管元件材料SILICON
Base Number Matches1

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PTFA092211EL
PTFA092211FL
Confidential, Limited Internal Distribution
Thermally-Enhanced High Power RF LDMOS FETs
220 W, 920 – 960 MHz
Description
The PTFA092211EL and PTFA092211FL are 220-watt, internally-
matched LDMOS FETs intended for EDGE and WCDMA applications
in the 920 to 960 MHz band. Manufactured with Infineon's advanced
LDMOS process, these devices provide excellent thermal
performance and superior reliability.
PTFA092211EL
Package H-33288-2
PTFA092211FL
Package H-34288-2
Two-carrier WCDMA Performance
V
DD
= 30 V, I
DQ
= 1.50 A, ƒ = 940 MHz, 3GPP WCDMA
signal, PAR = 6.5 dB, 5 MHz carrier spacing
40
35
-20
-25
Features
Broadband internal matching
Typical two-carrier WCDMA performance at
940 MHz, 30 V
- Average output power = 50 W
- Linear Gain = 18.0 dB
- Efficiency = 30%
- Intermodulation distortion = –37 dBc
Typical CW performance, 940 MHz, 30 V
- Output power at P–1dB = 250 W
- Gain = 17.0 dB
- Efficiency = 59%
Integrated ESD protection: Human Body Model,
Class 2 (minimum)
Excellent thermal stability, low HCI drift
Capable of handling 10:1 VSWR @ 30 V,
220 W (CW) output power
Pb-free, RoHS-compliant and thermally-enhanced
packages
Drain Efficiency (%)
ACPR (dBc)
30
25
20
15
10
40
41
42
43
44
45
46
47
48
49
-30
Efficiency
-35
-40
ACP
-45
-50
Output Power, Avg. (dBm)
RF Characteristics
Two-carrier WCDMA Measurements
(tested in Infineon test fixture)
V
DD
= 30 V, I
DQ
= 1750 mA, P
OUT
= 50 W (AVG),
ƒ
1
= 937.5 MHz, ƒ
2
= 942.5 MHz, 3GPP signal, channel bandwidth = 3.84 MHz, peak/average = 7.5 dB @ 0.01% CCDF
Characteristic
Gain
Drain Efficiency
Intermodulation Distortion
Symbol
G
ps
Min
17.0
28.5
Typ
18.0
30
–34
Max
–32
Unit
dB
%
dBc
η
D
IMD
All published data at T
CASE
= 25 °C unless otherwise indicated
*See Infineon distributor for future availability.
ESD:
Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet
1 of 10
Rev. 02, 2009-05-27

PTFA092211FLV4R250XTMA1相似产品对比

PTFA092211FLV4R250XTMA1 PTFA092211ELV4XWSA1 PTFA092211ELV4R250XTMA1 PTFA092211FLV4XWSA1
描述 IC FET RF LDMOS FET RF LDMOS 220W H33288-2 FET RF LDMOS 220W H33288-3 IC FET RF LDMOS
包装说明 FLATPACK, R-XDFP-F2 FLANGE MOUNT, R-XDFM-F2 FLANGE MOUNT, R-XDFM-F2 FLATPACK, R-XDFP-F2
Reach Compliance Code unknown unknown unknown unknown
其他特性 HGH RELIABILITY HGH RELIABILITY HGH RELIABILITY HGH RELIABILITY
外壳连接 SOURCE SOURCE SOURCE SOURCE
配置 SINGLE SINGLE SINGLE SINGLE
最小漏源击穿电压 65 V 65 V 65 V 65 V
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最高频带 ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 代码 R-XDFP-F2 R-XDFM-F2 R-XDFM-F2 R-XDFP-F2
元件数量 1 1 1 1
端子数量 2 2 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 200 °C 200 °C 200 °C 200 °C
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLANGE MOUNT FLANGE MOUNT FLATPACK
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
表面贴装 YES YES YES YES
端子形式 FLAT FLAT FLAT FLAT
端子位置 DUAL DUAL DUAL DUAL
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON SILICON SILICON
Base Number Matches 1 1 1 1

 
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