MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
Available
Surface Mount 1500 Watt
Transient Voltage Suppressor
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components. The SMCG gull-
wing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend
design in the DO-214AB package allows for greater PC board mounting density. Selections include
unidirectional and bidirectional as well as RoHS compliant versions. These are available with a
variety of upscreening options for enhanced reliability. They can protect against the secondary
effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous,
they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-215AB
(SMCG) Package
FEATURES
•
•
•
•
•
•
High reliability devices with fabrication and assembly lot traceability.
All devices are 100% surge tested.
3σ lot norm screening performed on standby current (I
D
).
Available in both unidirectional and bidirectional versions.
Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B.
Enhanced reliability screening options are available in reference to MIL-PRF-19500.
Refer to
High Reliability Up-Screened Plastic Products Portfolio
for more details on the screening
options.
(See
part nomenclature
for all available options).
RoHS compliant versions available.
Axial-lead equivalent packages for thru-hole mounting are available as 1.5KE6.8A to 1.5KE200CA
or 1N6267 thru 1N6303A and 1N5908 (contact Microsemi for other surface mount options).
DO-214AB
(SMCJ) Package
NOTE: All SMC series are
equivalent to prior SMM package
identifications.
•
•
Also available:
Commercial grade
SMCG(J)5.0A –
SMCG(J)170CAe3
APPLICATIONS / BENEFITS
•
•
•
•
•
High-reliability devices.
Selections for 5.0 to 170 volts standoff voltages (V
WM
).
Protection from switching transients and induced RF.
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4.
Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance:
Class 1: MSMC 5.0A to MXLSMC 170A or CA
Class 2: MSMC 5.0A to MXLSMC 150A or CA
Class 3: MSMC 5.0A to MXLSMC 75A or CA
Class 4: MSMC 5.0A to MXLSMC 36A or CA
Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance:
Class 1: MSMC 5.0A to MXLSMC 90A or CA
Class 2: MSMC 5.0A to MXLSMC 45A or CA
Class 3: MSMC 5.0A to MXLSMC 24A or CA
Class 4: MSMC 5.0A to MXLSMC 11A or CA
Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance:
Class 2: MSMC 5.0A to MXLSMC 22A or CA
Class 3: MSMC 5.0A to MXLSMC 10A or CA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
•
•
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
Page 1 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
(1)
Thermal Resistance Junction-to-Ambient
Peak Pulse Power Dissipation @ 25 ºC (at 10/1000
µs,
see
Figures 1, 2, and 3)
Impulse Repetition Rate (duty factor)
t
clamping
(0 volts to V
(BR)
min.)
Unidirectional
Bidirectional
Rated Average Power Dissipation
T
L
= +30 ºC
T
A
= +25 ºC
(2)
Maximum Forward Surge Current
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
PP
df
t
clamping
P
M(AV)
I
FSM
T
SP
Value
-65 to +150
20
80
1500
0.01
<100
<5
6
(1)
1.56
200
260
Unit
ºC
ºC/W
ºC/W
W
%
ps
ns
W
A (pk)
o
C
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
last page).
2. Peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional only).
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.
MARKING: Part number marked on package.
POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 0.25 grams.
See
Package Dimensions
on last page.
PART NOMENCLATURE
MX
Reliability Level*
M
MA
MX
MXL
*(see
High Reliability
Up-Screened Plastic
Products Portfolio)
Surface Mount
Package
1500 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
SM
C
G
5.0
C
A
e3
RoHS Compliance
e3 = RoHS Compliant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bidirectional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see
Electrical Characteristics
table)
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
Page 2 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
Symbol
I
(BR)
I
D
I
F
I
O
I
PP
P
PP
V
C
V
(BR)
V
WM
SYMBOLS & DEFINITIONS
Definition
Breakdown Current: The current used for measuring breakdown voltage V
(BR)
.
Standby Current: The current at the rated standoff voltage (V
WM
).
Forward Current: The forward current dc value, no alternating component.
Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle.
Peak Impulse Current: The peak current during the impulse.
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current I
PP
.
Clamping Voltage: Maximum clamping voltage at specified I
PP
(Peak Pulse Current) at the specified pulse conditions.
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is
also referred to as standoff voltage.
ELECTRICAL CHARACTERISTICS
@ 25 ºC unless otherwise stated
REVERSE
STAND-OFF
VOLTAGE
V
WM
Volts
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
BREAKDOWN
VOLTAGE
V
(BR)
@ I
(BR)
Volts
I
(BR)
MIN. MAX.
mA
6.40 – 7.00
10
6.67 – 7.37
10
7.22 – 7.98
10
7.78 – 8.60
10
8.33 – 9.21
1
8.89 – 9.83
1
9.44 – 10.4
1
10.0 – 11.1
1
11.1 – 12.3
1
12.2 – 13.5
1
13.3 – 14.7
1
14.4 – 15.9
1
15.6 – 17.2
1
16.7 – 18.5
1
17.8 – 19.7
1
18.9 – 20.9
1
20.0 – 22.1
1
22.2 – 24.5
1
24.4 – 26.9
1
26.7 – 29.5
1
28.9 – 31.9
1
31.1 – 34.4
1
33.3 – 36.8
1
36.7 – 40.6
1
40.0 – 44.2
1
44.4 – 49.1
1
47.8 – 52.8
1
50.0 – 55.3
1
53.3 – 58.9
1
56.7 – 62.7
1
60.0 – 66.3
1
64.4 – 71.2
1
66.7 – 73.7
1
71.1 – 78.6
1
77.8 – 86.0
1
83.3 – 92.1
1
MAXIMUM
CLAMPING
VOLTAGE
@ I
PP
Volts
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
121
PEAK PULSE
CURRENT
(See
Fig. 2)
I
PP
Amps
163.0
145.6
133.9
125.0
116.3
110.3
104.2
97.4
88.2
82.4
75.3
69.7
64.7
61.5
57.7
53.3
51.4
46.3
42.2
38.6
35.6
33.0
31.0
28.1
25.8
23.2
21.6
20.6
19.4
18.2
17.2
16.0
15.5
14.6
13.3
12.4
MAXIMUM
STANDBY
CURRENT
@ V
WM
I
D
µA
1000
1000
500
200
100
50
20
10
5
5
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
MICROSEMI PART NUMBER
Gull-Wing
MSMCG5.0A
MSMCG6.0A
MSMCG6.5A
MSMCG7.0A
MSMCG7.5A
MSMCG8.0A
MSMCG8.5A
MSMCG9.0A
MSMCG10A
MSMCG11A
MSMCG12A
MSMCG13A
MSMCG14A
MSMCG15A
MSMCG16A
MSMCG17A
MSMCG18A
MSMCG20A
MSMCG22A
MSMCG24A
MSMCG26A
MSMCG28A
MSMCG30A
MSMCG33A
MSMCG36A
MSMCG40A
MSMCG43A
MSMCG45A
MSMCG48A
MSMCG51A
MSMCG54A
MSMCG58A
MSMCG60A
MSMCG64A
MSMCG70A
MSMCG75A
Continued.
J-Bend
MSMCJ5.0A
MSMCJ6.0A
MSMCJ6.5A
MSMCJ7.0A
MSMCJ7.5A
MSMCJ8.0A
MSMCJ8.5A
MSMCJ9.0A
MSMCJ10A
MSMCJ11A
MSMCJ12A
MSMCJ13A
MSMCJ14A
MSMCJ15A
MSMCJ16A
MSMCJ17A
MSMCJ18A
MSMCJ20A
MSMCJ22A
MSMCJ24A
MSMCJ26A
MSMCJ28A
MSMCJ30A
MSMCJ33A
MSMCJ36A
MSMCJ40A
MSMCJ43A
MSMCJ45A
MSMCJ48A
MSMCJ51A
MSMCJ54A
MSMCJ58A
MSMCJ60A
MSMCJ64A
MSMCJ70A
MSMCJ75A
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
Page 3 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
ELECTRICAL CHARACTERISTICS
@ 25 ºC unless otherwise stated (continued)
REVERSE
STAND-OFF
VOLTAGE
V
WM
Volts
78
85
90
100
110
120
130
150
160
170
BREAKDOWN
VOLTAGE
V
(BR)
@ I
(BR)
Volts
I
(BR)
MIN. MAX.
mA
86.7 – 95.8
1
94.4 – 104.0
1
100 – 111
1
111 – 123
1
122 – 135
1
133 – 147
1
144 – 159
1
167 – 185
1
178 – 197
1
189 – 209
1
MAXIMUM
CLAMPING
VOLTAGE
@ I
PP
Volts
126
137
146
162
177
193
209
243
259
275
PEAK PULSE
CURRENT
(See
Fig. 2)
I
PP
Amps
11.4
10.4
10.3
9.3
8.4
7.8
7.2
6.2
5.8
5.5
MAXIMUM
STANDBY
CURRENT
@ V
WM
I
D
µA
1
1
1
1
1
1
1
1
1
1
MICROSEMI PART NUMBER
Gull-Wing
MSMCG78A
MSMCG85A
MSMCG90A
MSMCG100A
MSMCG110A
MSMCG120A
MSMCG130A
MSMCG150A
MSMCG160A
MSMCG170A
J-Bend
MSMCJ78A
MSMCJ85A
MSMCJ90A
MSMCJ100A
MSMCJ110A
MSMCJ120A
MSMCJ130A
MSMCJ150A
MSMCJ160A
MSMCJ170A
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
Page 4 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
GRAPHS
100
(Waveform – See Figure 2)
Non-repetitive
10
Test wave form
parameters
tr = 10
µsec.
tp = 1000
µsec.
1.0
0
1µs
10µsec
100µsec
1ms
tp – Pulse Time – sec
10ms
t – Time (msec)
I
PP
– Peak Pulse Current - % I
PP
(P
PP
) – Peak Pulse Power - kW
FIGURE 2
– Pulse Waveform
FIGURE 1 –
Peak Pulse Power vs. Pulse Time
Peak Pulse Power (
P
PP
) or continuous
Power in Percent of 25
o
C Rating
T
L
Lead Temperature
o
C
C – Capacitance (pF)
B
V
– Breakdown Voltage (V)
FIGURE 3 –
Derating Curve
FIGURE 4
Typical Capacitance vs.
Breakdown Voltage (unidirectional configuration)
NOTE: Bidirectional capacitance is half that shown at zero volts.
RF01001, Rev. A (1/4/13)
©2013 Microsemi Corporation
Page 5 of 7
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
