IC MONITOR VOLT MPU 16-SOIC
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
其他特性 | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e3 |
长度 | 9.9 mm |
湿度敏感等级 | 1 |
信道数量 | 5 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电流 (Isup) | 0.033 mA |
最大供电电压 (Vsup) | 11 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
MAX8213ACSE+T | MAX8214BC/D | MAX8213BC/D | MAX8214 | MAX8213 | MAX8213BCSE+T | MAX8213BESE+T | MAX8214AESE+T | MAX8213AESE/GG8-T | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC MONITOR VOLT MPU 16-SOIC | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16 | IC MONITOR VOLT MPU 16-SOIC | IC MONITOR VOLT MPU 16-SOIC | IC MONITOR VOLT MPU 16-SOIC | Power Supply Support Circuit |
可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
是否无铅 | 不含铅 | 含铅 | 含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | - | - | 符合 | 符合 | 符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | DIE | DIE | - | - | SOIC | SOIC | SOIC | - |
包装说明 | SOP, | DIE-16 | DIE, DIE OR CHIP | - | - | SOP, SOP16,.25 | SOP, | SOP, | SOP, SOP16,.23 |
针数 | 16 | 16 | 16 | - | - | 16 | 16 | 16 | - |
Reach Compliance Code | compliant | _compli | _compli | - | - | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | - | 6 weeks | - | - | 6 weeks | 13 weeks | 6 weeks | - |
其他特性 | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | - | - | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | 4 PRECISION VOLTAGE COMPARATOR FOR UNDERVOLTAGE/OVERVOLTAGE MONITORING | - |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G16 | R-XUUC-N16 | R-XUUC-N16 | - | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e3 | e0 | e0 | - | - | e3 | e3 | e3 | - |
长度 | 9.9 mm | - | - | - | - | 9.9 mm | 9.9 mm | 9.9 mm | 9.893 mm |
信道数量 | 5 | 5 | 5 | - | - | 5 | 5 | 5 | 1 |
最高工作温度 | 70 °C | 70 °C | 70 °C | - | - | 70 °C | 85 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIE | DIE | - | - | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | - | - | 260 | 260 | 260 | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 1.75 mm | - | - | - | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.753 mm |
最大供电电流 (Isup) | 0.033 mA | 0.033 mA | 0.033 mA | - | - | 0.033 mA | 0.033 mA | 0.033 mA | 0.033 mA |
最大供电电压 (Vsup) | 11 V | 11 V | 11 V | - | - | 11 V | 11 V | 11 V | 11 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | - | 2.7 V | 2.85 V | 2.85 V | 2.85 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
技术 | CMOS | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | - |
端子面层 | Matte Tin (Sn) | TIN LEAD | TIN LEAD | - | - | Matte Tin (Sn) | TIN | TIN | - |
端子节距 | 1.27 mm | - | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | - | - | - | - | 3.9 mm | 3.9 mm | 3.9 mm | 3.911 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved