MUX16NTBC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 16 |
| 功能数量 | 1 |
| 最大通态电阻 (Ron) | 540 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | 25 °C |
| 封装等效代码 | DIE OR CHIP |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 24 mA |
| 标称供电电压 (Vsup) | 15 V |
| 切换 | BREAK-BEFORE-MAKE |
| 温度等级 | OTHER |
| Base Number Matches | 1 |
| MUX16NTBC | 5962-01-168-4078 | MUX16BTCMDX | MUX16BTCMDA | MUX16BTMDB | MUX28NTBC | MUX28GTBC | MUX16ATMDB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | MUX16NTBC | IC IC,ANALOG MUX,SINGLE,16-CHANNEL,BIPOLAR/JFET,DIP,28PIN,CERAMIC, Multiplexer or Switch | MUX16BTCMDX | MUX16BTCMDA | MUX16BTMDB | MUX28NTBC | MUX28GTBC | MUX16ATMDB |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | unknown | unknown | unknown |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 16 | 16 | 16 | 16 | 16 | 8 | 8 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大通态电阻 (Ron) | 540 Ω | 500 Ω | 800 Ω | 800 Ω | 800 Ω | 540 Ω | 800 Ω | 500 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | 25 °C | -55 °C | -55 °C | -55 °C | -55 °C | 25 °C | 25 °C | -55 °C |
| 封装等效代码 | DIE OR CHIP | DIP28,.6 | LCC28,.45SQ | LCC28,.45SQ | DIP28,.6 | DIE OR CHIP | DIE OR CHIP | DIP28,.6 |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 温度等级 | OTHER | MILITARY | MILITARY | MILITARY | MILITARY | OTHER | OTHER | MILITARY |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| 筛选级别 | MIL-STD-883 Class B (Modified) | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
| JESD-30 代码 | - | R-XDIP-T28 | S-XQCC-N28 | S-XQCC-N28 | R-XDIP-T28 | - | - | R-XDIP-T28 |
| 端子数量 | - | 28 | 28 | 28 | 28 | - | - | 28 |
| 封装主体材料 | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | - | CERAMIC |
| 封装代码 | - | DIP | QCCN | QCCN | DIP | - | - | DIP |
| 封装形状 | - | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | - | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | - | - | IN-LINE |
| 表面贴装 | - | NO | YES | YES | NO | - | - | NO |
| 端子形式 | - | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | - | - | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | - | 2.54 mm |
| 端子位置 | - | DUAL | QUAD | QUAD | DUAL | - | - | DUAL |
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