SRAM Module, 256KX32, 35ns, BICMOS
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| Is Samacsys | N |
| 最长访问时间 | 35 ns |
| JESD-30 代码 | R-XZMA-T64 |
| JESD-609代码 | e0 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 64 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX32 |
| 可输出 | YES |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| IDT7MP4045SA35Z | IDT7MP4045SA35M | IDT7MP4045SA17Z | IDT7MP4045S17M | IDT7MP4045S17Z | IDT7MP4045S35Z | IDT7MP4045S35M | IDT7MP4045SA17M | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 256KX32, 35ns, BICMOS | SRAM Module, 256KX32, 35ns, BICMOS | SRAM Module, 256KX32, 17ns, BICMOS | SRAM Module, 256KX32, 17ns, BICMOS | SRAM Module, 256KX32, 17ns, BICMOS | SRAM Module, 256KX32, 35ns, BICMOS | SRAM Module, 256KX32, 35ns, BICMOS | SRAM Module, 256KX32, 17ns, BICMOS |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 35 ns | 35 ns | 17 ns | 17 ns | 17 ns | 35 ns | 35 ns | 17 ns |
| JESD-30 代码 | R-XZMA-T64 | R-XSMA-N64 | R-XZMA-T64 | R-XSMA-N64 | R-XZMA-T64 | R-XZMA-T64 | R-XSMA-N64 | R-XSMA-N64 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | 225 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子位置 | ZIG-ZAG | SINGLE | ZIG-ZAG | SINGLE | ZIG-ZAG | ZIG-ZAG | SINGLE | SINGLE |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Is Samacsys | N | N | N | N | N | - | - | - |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| I/O 类型 | - | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装代码 | - | - | ZIP | SIMM | ZIP | ZIP | SIMM | SIMM |
| 封装等效代码 | - | - | ZIP64/68,.1,.1 | SSIM64 | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | SSIM64 | SSIM64 |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 座面最大高度 | - | - | 15.24 mm | 16.002 mm | 15.24 mm | 15.24 mm | 16.764 mm | 16.764 mm |
| 最大待机电流 | - | - | 0.32 A | 0.32 A | 0.32 A | 0.12 A | 0.12 A | 0.32 A |
| 最小待机电流 | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | - | - | 1.6 mA | 1.6 mA | 1.6 mA | 1.36 mA | 1.36 mA | 1.6 mA |
| 端子节距 | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
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