IC TXRX NON-INVERT 3.6V 20DHVQFN
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 20 |
| 制造商包装代码 | SOT764-1 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 8 weeks |
| Samacsys Description | 74LVC(H)245A - Octal bus transceiver; 3-state@en-us |
| 其他特性 | WITH DIRECTION CONTROL |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 4.5 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 9.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2.5 mm |
| Base Number Matches | 1 |

| 74LVC245ABQ,115 | 74LVCH245ABQ,115 | 74LVCH245ABX,115 | 74LVCH245ADB,112 | 74LVCH245AD,112 | 74LVCH245AD,118 | 74LVC245ABQ | |
|---|---|---|---|---|---|---|---|
| 描述 | IC TXRX NON-INVERT 3.6V 20DHVQFN | IC TXRX NON-INVERT 3.6V 20DHVQFN | IC TXRX NON-INVERT 3.6V 20DHXQFN | IC TXRX NON-INVERT 3.6V 20SSOP | IC TRANSCVR NON-INVERT 3.6V 20SO | IC TRANSCVR NON-INVERT 3.6V 20SO | 逻辑类型:收发器,非反相 额外特性:三态 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | HVQCCN, | 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20 | DHXQFN-20 | 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20 | SOP, | SOP, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | - |
| 零件包装代码 | QFN | QFN | QFN | SSOP2 | SOP | SOP | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| 制造商包装代码 | SOT764-1 | SOT764-1 | SOT1045-2 | SOT339-1 | SOT163-1 | SOT163-1 | - |
| Samacsys Description | 74LVC(H)245A - Octal bus transceiver; 3-state@en-us | NXP 74LVCH245ABQ,115, Bus Transceiver, 8-Bit Non-Inverting LVTTL, 1.2 → 3.6 V, 20-Pin DHVQFN | - | - | NXP 74LVCH245AD,112, 1 Bus Transceiver, Bus Transceiver, 8-Bit Non-Inverting LVTTL, 20-Pin SOIC | 74LVC(H)245A - Octal bus transceiver; 3-state@en-us | - |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | - | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PQCC-N20 | R-PQCC-N20 | - | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 |
| JESD-609代码 | e4 | e4 | - | e4 | e4 | e4 | e4 |
| 长度 | 4.5 mm | 4.5 mm | - | 7.2 mm | 12.8 mm | 12.8 mm | 4.5 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | - | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | - | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | - | SSOP | SOP | SOP | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | - | 260 | 260 | 260 | 260 |
| 传播延迟(tpd) | 9.5 ns | 9.5 ns | - | 9.5 ns | 9.5 ns | 9.5 ns | 16.9 ns |
| 座面最大高度 | 1 mm | 1 mm | - | 2 mm | 2.65 mm | 2.65 mm | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 1.8 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | - | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.65 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | - | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 | 30 |
| 宽度 | 2.5 mm | 2.5 mm | - | 5.3 mm | 7.5 mm | 7.5 mm | 2.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | 1 |
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