电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

FW-38-05-L-D-390-100

产品描述.050'' BOARD SPACERS
产品类别连接器   
文件大小852KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

FW-38-05-L-D-390-100概述

.050'' BOARD SPACERS

FW-38-05-L-D-390-100规格参数

参数名称属性值
针脚数76
间距0.050"(1.27mm)
排数2
排距0.050"(1.27mm)
长度 - 整体引脚0.490"(12.446mm)
长度 - 柱(配接)0.100"(2.540mm)
长度 - 叠接高度0.390"(9.906mm)
安装类型表面贴装
端接焊接
触头镀层 - 柱(配接)
触头镀层厚度 - 柱(配接)10.0µin (0.25µm)
颜色黑色

文档预览

下载PDF文档
F-219
FW–20–05–F–D–610–065
FW–12–05–G–D–530–101
(1.27 mm) .050"
FW-SM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
CLP, FLE
Cable Mates:
FFSD
Low-profile or
skyscraper styles
APPLICATIONS
Variable
board spacing
MATED
HEIGHT
FW
CLP
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MATED
CLP HEIGHT*
(8.13)
FW-XX-03-X-X-233-065
.320
–02
(9.91)
FW-XX-03-X-X-303-065
.390
*Processing conditions will affect mated height.
LEAD STYLE
FW
(1.27 mm x 1.27 mm)
.050" x .050" micro pitch
Surface
mount
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
STACKER
HEIGHT
POST
HEIGHT
OPTION
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
02 thru 50
= Gold flash on post,
Matte Tin on tail
–F
–L
–“XXX”
= Stacker
Height
(in inches)
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
–“XXX”
LEAD STACKER
STYLE HEIGHT
–03
–05
STACKER
HEIGHT
(5.46) (8.51) (7.11) (10.16)
.215 to .335
.280 to .400
(8.64) (15.49) (10.29) (17.15)
.340 to .610
.405 to .675
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
Example:
–250
= (6.35 mm)
.250"
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
= Pick & Place Pad
(5 positions min.)
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–ES
02
No. of positions x
(1.27) .050
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
100
–G
–EP
(3.42)
.135
(1.27)
.050
01
(1.19)
.047
(1.27) .050
(0.41) .016 SQ
99
(4.76)
.188
POST HEIGHT
(1.65) .065
MIN
(4.27)
.168
(0.76)
.030
(3.45)
.136
x
(5.08)
.200
(4.06)
.160
–A
–ES
(3.05)
.120
(1.91)
.075
DIA
–P
(0.86)
.034
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–P
STACKER
HEIGHT
(2.51)
.099
(2.92)
.115
–TR
–EP
Due to technical progress, all designs, specifications and components are subject to change without notice.
(0.89)
.035
DIA
–A
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

推荐资源

关于USB设备的读取
{ m_strLog += _T("抱歉,未找到可用的USB设备");...
wzqd2001 嵌入式系统
选一选——4款适合不同IoT架构的MCU,你最青睐哪种?
物联网 (IoT) 的早期阶段已经开始改变我们的生活方式、商业模式和决策方法,TI MSP430™微控制器(MCU) 正在为这些改变提供超低功耗的架构来实现IoT应用。这其中包括针对最低待机功耗、有源 ......
maylove 微控制器 MCU
提问:evc4.0能否支持DirectX9.0??
公司要我在WINCE下实现Direct3D应用,我以前没用过EVC4.0,但用过VC6.0。在EVC中我只加进头文件后就发生以下错误: pogram Files\Microsoft DirectX 9.0 SDK (December 2004)\Include\d3dx9math ......
liren198 嵌入式系统
WINCE 竖屏图标重复
屏幕旋转后换成了竖屏,但是桌面上出现了上下重复的图标,请问怎么解决啊,谢谢~~~~...
gzzhida 嵌入式系统
急需!!毕业设计,题目《IC卡的身份识别开关》
周六就要交给老师看了,可才做了一半,实在找不到资料了,请求各路朋友帮帮忙啊!!!...
chenjuan8168 单片机
驱动为何会装载后马上卸载?
写了个USB转COM口的驱动,但是为何系统启动过程中装载完驱动就迅速卸载? 打印信息, USBToCOM::Process Attach USBToCOM::Process Detach sources文件 RELEASETYPE=PLATFORM TARGE ......
shesay 嵌入式系统

热门文章更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 992  738  1025  86  1567  20  15  21  2  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved