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MX66L1G45GXDI-10G: 产品描述IC FLASH SERIAL NOR 1G 24CSP; 产品类别存储存储; 文件大小1MB，共132页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX66L1G45GXDI-10G概述

IC FLASH SERIAL NOR 1G 24CSP

MX66L1G45GXDI-10G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
包装说明	BGA-24
Reach Compliance Code	unknown
Factory Lead Time	16 weeks
其他特性	ALSO IT CAN BE CONFIGURED AS 1G X 1 BIT
备用内存宽度	2
最大时钟频率 (fCLK)	104 MHz
JESD-30 代码	R-PBGA-B24
长度	8 mm
内存密度	1073741824 bit
内存集成电路类型	FLASH
内存宽度	4
功能数量	1
端子数量	24
字数	268435456 words
字数代码	256000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256MX4
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
编程电压	2.7 V
座面最大高度	1.2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	6 mm

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MX66L1G45G

3V, 1G-BIT [x 1/x 2/x 4]

CMOS MXSMIO

(SERIAL MULTI I/O)

FLASH MEMORY

Key Features

• Advanced sector protection function (Solid and Password Protect)

• Multi I/O Support - Single I/O, Dual I/O, and Quad I/O

• Support DTR (Double Transfer Rate) Mode

• Support clock frequency up to 166MHz

• Quad Peripheral Interface (QPI) Read / Program Mode

MX66L1G45G

Contents

1. FEATURES .............................................................................................................................................................. 4

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Read performance Comparison ....................................................................................................6

3. PIN CONFIGURATIONS ......................................................................................................................................... 7

4. PIN DESCRIPTION .................................................................................................................................................. 7

5. BLOCK DIAGRAM................................................................................................................................................... 8

6. DATA PROTECTION................................................................................................................................................ 9

Table 2. Protected Area Sizes ...................................................................................................................10

Table 3. 4K-bit Secured OTP Definition

.................................................................................................... 11

7. Memory Organization ........................................................................................................................................... 12

Table 4. Memory Organization ..................................................................................................................12

8. DEVICE OPERATION ............................................................................................................................................ 13

8-1. 256Mb Address Protocol .......................................................................................................................... 15

8-2. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 19

9. COMMAND DESCRIPTION ................................................................................................................................... 20

Table 5. Command Set..............................................................................................................................20

9-1. Write Enable (WREN) .............................................................................................................................. 25

9-2. Write Disable (WRDI)............................................................................................................................... 26

9-3. Factory Mode Enable (FMEN) ................................................................................................................. 27

9-4. Read Identification (RDID)

....................................................................................................................... 28

9-5. Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 29

9-6. Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 31

9-7. QPI ID Read (QPIID) ............................................................................................................................... 32

Table 6. ID Definitions

..............................................................................................................................32

9-8. Read Status Register (RDSR) ................................................................................................................. 33

9-9. Read Configuration Register (RDCR)

...................................................................................................... 34

Table 7. Status Register ............................................................................................................................37

Table 8. Configuration

Register .................................................................................................................38

Table 9. Output Driver Strength Table .......................................................................................................39

9-10. Write Status Register (WRSR)................................................................................................................. 40

Table 10. Protection Modes.......................................................................................................................41

9-11. Enter 4-byte mode (EN4B) ...................................................................................................................... 44

9-12. Exit 4-byte mode (EX4B) ......................................................................................................................... 44

9-13. Read Data Bytes (READ) ........................................................................................................................ 45

9-14. Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 46

9-15. Dual Output Read Mode (DREAD) .......................................................................................................... 47

9-16. 2 x I/O Read Mode (2READ) ................................................................................................................... 48

9-17. Quad Read Mode (QREAD) .................................................................................................................... 49

9-18. 4 x I/O Read Mode (4READ) ................................................................................................................... 50

9-19. Fast Double Transfer Rate Read (FASTDTRD) ....................................................................................... 52

9-20. 2 x I/O Double Transfer Rate Read Mode (2DTRD) ................................................................................ 53

9-21. 4 x I/O Double Transfer Rate Read Mode (4DTRD) ................................................................................ 54

9-22. Preamble Bit ........................................................................................................................................... 56

9-23. 4-Byte Address Command Set ................................................................................................................ 61

9-24. Performance Enhance Mode ................................................................................................................... 67

9-25. Burst Read ............................................................................................................................................... 72

9-26. Fast Boot ................................................................................................................................................. 73

Table 11. Fast Boot Register (FBR) ..........................................................................................................73

9-27. Sector Erase (SE) .................................................................................................................................... 76

P/N: PM2018

Rev. 1.3, July 18, 2017

MX66L1G45G

Block Erase (BE32K) ............................................................................................................................... 77

Block Erase (BE) ..................................................................................................................................... 78

Chip Erase (CE) ....................................................................................................................................... 79

Page Program (PP) ................................................................................................................................. 80

4 x I/O Page Program (4PP) .................................................................................................................... 82

Deep Power-down (DP) ........................................................................................................................... 83

Enter Secured OTP (ENSO) .................................................................................................................... 84

Exit Secured OTP (EXSO) ....................................................................................................................... 84

Read Security Register (RDSCUR) ......................................................................................................... 84

Write Security Register (WRSCUR)......................................................................................................... 84

Table 12. Security Register Definition

.......................................................................................................85

9-38. Write Protection Selection (WPSEL)........................................................................................................ 86

9-39. Advanced Sector Protection .................................................................................................................... 88

Table 13. Lock Register.............................................................................................................................89

Table 14. SPB Lock Register ...................................................................................................................90

Table 15. SPB Register .............................................................................................................................91

Table 16. DPB Register ............................................................................................................................93

9-40. Program/Erase Suspend/Resume ........................................................................................................... 97

9-41. Erase Suspend ........................................................................................................................................ 97

9-42. Program Suspend .................................................................................................................................... 97

9-43. Write-Resume .......................................................................................................................................... 99

9-44. No Operation (NOP) ................................................................................................................................ 99

9-45. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 99

9-46. Read SFDP Mode (RDSFDP)................................................................................................................ 101

Table 17. Signature and Parameter Identification Data Values

..............................................................102

Table 18. Parameter Table (0): JEDEC Flash Parameter Tables ............................................................104

Table 19. Parameter Table (1): 4-Byte Instruction Tables ....................................................................... 111

Table 20. Parameter Table (2): Macronix Flash Parameter Tables ......................................................... 113

10. RESET................................................................................................................................................................ 115

Table 21. Reset Timing-(Power On) ........................................................................................................ 115

Table 22. Reset Timing-(Other Operation) .............................................................................................. 115

11. POWER-ON STATE ........................................................................................................................................... 116

12. ELECTRICAL SPECIFICATIONS ...................................................................................................................... 117

Table 23. ABSOLUTE MAXIMUM RATINGS .......................................................................................... 117

Table 24. CAPACITANCE TA = 25°C, f = 1.0 MHz .................................................................................. 117

Table 25. DC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V - 3.6V)

...................... 119

Table 26. AC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V - 3.6V)

.....................120

13. OPERATING CONDITIONS ............................................................................................................................... 122

Table 27. Power-Up/Down Voltage and Timing

......................................................................................124

13-1. INITIAL DELIVERY STATE

.................................................................................................................... 124

14. ERASE AND PROGRAMMING PERFORMANCE ............................................................................................ 125

15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode) ................................................................. 125

16. DATA RETENTION ............................................................................................................................................ 126

17. LATCH-UP CHARACTERISTICS ...................................................................................................................... 126

18. ORDERING INFORMATION .............................................................................................................................. 127

19. PART NAME DESCRIPTION ............................................................................................................................. 128

20. PACKAGE INFORMATION ................................................................................................................................ 129

20-1. 16-pin SOP (300mil) .............................................................................................................................. 129

20-2. 24-Ball BGA (5x5 ball array) .................................................................................................................. 130

21. REVISION HISTORY ......................................................................................................................................... 131

9-28.

9-29.

9-30.

9-31.

9-32.

9-33.

9-34.

9-35.

9-36.

9-37.

P/N: PM2018

Rev. 1.3, July 18, 2017

MX66L1G45GXDI-10G相似产品对比

	MX66L1G45GXDI-10G	MX66L1G45GXDL-10G	MX66L1G45GXDJ-10G	MX66L1G45GXDI-08G
描述	IC FLASH SERIAL NOR 1G 24CSP	IC FLASH SERIAL NOR 1G 24CSP	IC FLASH SERIAL NOR 1G 24CSP	IC FLASH SERIAL NOR 1G 24CSP

MX66L1G45GXDI-10G

MX66L1G45GXDI-10G概述

MX66L1G45GXDI-10G规格参数

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