State Diagram ....................................................................................................................................................... 20
Core LTC6811 State Descriptions ......................................................................................................................... 20
isoSPI State Descriptions ..................................................................................................................................... 21
Power Consumption ............................................................................................................................................. 21
Data Acquisition System Diagnostics ................................................................................................................... 28
Watchdog and Discharge Timer ............................................................................................................................ 34
S Pin Pulse Width Modulation for Cell Balancing .................................................................................................. 35
I
2
C/SPI Master on LTC6811 Using GPIOs............................................................................................................. 36
S Pin Pulsing Using the S Control Register Group................................................................................................ 40
Serial Interface Overview ...................................................................................................................................... 41
4-Wire Serial Peripheral Interface (SPI) Physical Layer ........................................................................................ 41
Data Link Layer ..................................................................................................................................................... 49
Applications Information .......................................................................................................64
Providing DC Power.............................................................................................................................................. 64
Internal Protection and Filtering ............................................................................................................................ 66
Discharge Control During Cell Measurements ...................................................................................................... 70
Digital Communications ........................................................................................................................................ 72
LTC6811I ..............................................–40°C to 85°C
LTC6811H .......................................... –40°C to 125°C
Specified Temperature Range
LTC6811I ..............................................–40°C to 85°C
LTC6811H .......................................... –40°C to 125°C
Junction Temperature ........................................... 150°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering 10 sec).................... 300°C
PIN CONFIGURATION
LTC6811-1
V
+
C12
S12
C11
S11
C10
S10
C9
S9
1
2
3
4
5
6
7
8
9
TOP VIEW
48 IPB
47 IMB
46 ICMP
45 IBIAS
44 SDO (NC)*
43 SDI (NC)*
42 SCK (IPA)*
41 CSB (IMA)*
40 ISOMD
39 WDT
38 DRIVE
37 V
REG
36 DTEN
35 V
REF1
34 V
REF2
33 GPIO5
32 GPIO4
31 V–
30 V–**
29 GPIO3
28 GPIO2
27 GPIO1
26 C0
25 S1
LTC6811-2
V
+
C12
S12
C11
S11
C10
S10
C9
S9
1
2
3
4
5
6
7
8
9
TOP VIEW
48 A3
47 A2
46 A1
45 A0
44 SDO (IBIAS)*
43 SDI (ICMP)*
42 SCK (IPA)*
41 CSB (IMA)*
40 ISOMD
39 WDT
38 DRIVE
37 V
REG
36 DTEN
35 V
REF1
34 V
REF2
33 GPIO5
32 GPIO4
31 V–
30 V–**
29 GPIO3
28 GPIO2
27 GPIO1
26 C0
25 S1
C8 10
S8 11
C7 12
S7 13
C6 14
S6 15
C5 16
S5 17
C4 18
S4 19
C3 20
S3 21
C2 22
S2 23
C1 24
C8 10
S8 11
C7 12
S7 13
C6 14
S6 15
C5 16
S5 17
C4 18
S4 19
C3 20
S3 21
C2 22
S2 23
C1 24
G PACKAGE
48-LEAD PLASTIC SSOP
G PACKAGE
48-LEAD PLASTIC SSOP
T
JMAX
= 150°C,
θ
JA
= 55°C/W
*THE FUNCTION OF THESE PINS DEPENDS ON THE CONNECTION OF ISOMD
ISOMD TIED TO V
–
: CSB, SCK, SDI, SDO
ISOMD TIED TO V
REG
: IMA, IPA, NC, NC
**THIS PIN MUST BE CONNECTED TO V
–
T
JMAX
= 150°C,
θ
JA
= 55°C/W
*THE FUNCTION OF THESE PINS DEPENDS ON THE CONNECTION OF ISOMD
ISOMD TIED TO V
–
: CSB, SCK, SDI, SDO
ISOMD TIED TO V
REG
: IMA, IPA, NC, NC
**THIS PIN MUST BE CONNECTED TO V
–
68111fb
For more information
www.linear.com/LTC6811-1
3
LTC6811-1/LTC6811-2
ORDER INFORMATION
TUBE
LTC6811IG-1#PBF
LTC6811HG-1#PBF
LTC6811IG-2#PBF
LTC6811HG-2#PBF
TAPE AND REEL
LTC6811IG-1#TRPBF
LTC6811HG-1#TRPBF
LTC6811IG-2#TRPBF
LTC6811HG-2#TRPBF
http://www.linear.com/product/LTC6811-1#orderinfo
PART MARKING*
LTC6811G-1
LTC6811G-1
LTC6811G-2
LTC6811G-2
PACKAGE DESCRIPTION
48-Lead Plastic SSOP
48-Lead Plastic SSOP
48-Lead Plastic SSOP
48-Lead Plastic SSOP
SPECIFIED
TEMPERATURE RANGE
–40°C to 85°C
–40°C to 125°C
–40°C to 85°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Parts ending with PBF are RoHS and WEEE compliant.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. The test conditions are V
+
= 39.6V, V
REG
= 5.0V unless otherwise noted.
The ISOMD pin is tied to the V
–
pin, unless otherwise noted.
SYMBOL
PARAMETER
Measurement Resolution
ADC Offset Voltage
ADC Gain Error
Total Measurement Error (TME) in Normal
Mode
(Note 2)
(Note 2)
l
ELECTRICAL CHARACTERISTICS
CONDITIONS
l
l
MIN
TYP
0.1
0.1
0.01
0.02
±0.2
±0.1
MAX
UNITS
mV/bit
mV
%
%
mV
ADC DC Specifications
C(n) to C(n – 1), GPIO(n) to V
–
= 0
C(n) to C(n – 1) = 2.0
C(n) to C(n – 1), GPIO(n) to V
–
= 2.0
C(n) to C(n – 1) = 3.3
C(n) to C(n – 1), GPIO(n) to V
–
= 3.3
C(n) to C(n – 1) = 4.2
C(n) to C(n – 1), GPIO(n) to V
–
= 4.2
C(n) to C(n – 1), GPIO(n) to V
–
= 5.0
Sum of Cells
Internal Temperature, T = Maximum Specified
Temperature
V
REG
Pin
V
REF2
Pin
Digital Supply Voltage V
REGD
l
l
l
l
l
l
l
±0.8
±1.4
±1.2
±2.2
±1.6
±2.8
mV
mV
mV
mV
mV
mV
mV
%
°C
±0.2
±0.3
±1
±0.05
±5
±0.1
±0.02
±0.1
±0.25
±0.25
±0.1
±1
%
%
%
4
68111fb
For more information
www.linear.com/LTC6811-1
LTC6811-1/LTC6811-2
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
当今的计算机外部设备，都在追求高速度和高通用性。为了满足用户的需求，以Intel为首的七家公司于1994年推出了USB（Universal Serial Bus，通用串行总线）总线协议，专用于低、中速的计算机外设。目前，USB端口已成为微机主板的标准端口；而在不久的将来，所有的微机外设，包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等，都将通过USB与主机相连。
...[详细]
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