MU Series
Ultra Precision SMT Resistor 1-2-3 Network
(Molded, J-Lead Terminal)
RESISTANCE RANGE, TOLERANCE,
RATED POWER
Type
Resistance
Range
Element**
10Ω ≤R <100Ω
Resistance Tolerance*
Absolute*
±0.1% (B)
±0.5% (D)
±0.05% (A)
±0.1% (B)
±0.5% (D)
±0.02% (Q)
±0.05% (A)
±0.1% (B)
± 0.5% (D)
Matching*
±0.05% (A)
±0.1% (B)
±0.5% (D)
±0.02% (Q)
±0.05% (A)
±0.1% (B)
± 0.5% (D)
±0.01% (T)
±0.02% (Q)
±0.05% (A)
± 0.1% (B)
±0.5% (D)
Rated Power/
Element
(W) at 125°C
MU
COMPOSITION OF TYPE NUMBER
MU
100Ω ≤R <1kΩ
0.05
MU 1K000/ 10K00 B Q L
*
**
1kΩ ≤R ≤20kΩ
Symbols in parentheses are for type number composition.
Please contact us for the availability.
ABSOLUTE TCR
CONFIGURATION
(DIMENSIONS IN mm)
P
1
L
P
1
TCR TRACKING
Resistance
Ratio
Ratio = 1
1 <Ratio ≤10
10 <Ratio ≤100
100 <Ratio
TCR Track-
ing (ppm/°C)
–55°C to
+125°C
±1
±2
±3
±5
Resistance
Range (Ω)
10Ω ≤R <30Ω
30Ω ≤R <100Ω
Internal Circuit
(Top View)
PIN 2
Common PIN
Absolute TCR
(ppm/°C)
–55C to
+125°C
±15
±10
±5
P
3
P
2
L
1
P
3
W
R
1
R
2
100Ω ≤R ≤20kΩ
PIN 1
W
1
PIN 3
Applicable >50 Ω
FREQUENCY CHARACTERISTICS
W
3
L
4
W
3
H
3
L
2
L
3
W
2
t
L
3
(%)
150
R(AC)/R(DC)
H
1
H
2
H
L
3.2
±0.2
W1
2.7
±0.2
W
2.5
±0.2
W2
2.7
±0.2
H
1.5
±0.2
W3
0.8
±0.1
H1
1.4
±0.2
L1
3.0
±0.2
H2
1.6
±0.2
L2
0.7
±0.2
H3
1.1
±0.2
L3
0.8
±0.1
P1
1.6
±0.1
L4
3.0
±0.2
P2
1.4
±0.1
t
0.1
±0.05
P3
0.9
±0.1
100
50
47.5
100
1k
5k
10 k
20 k
1
10
Frequency
100
(MHz)
POWER DERATING CURVE
Rated Power Percentage
100
80
60
40
20
20
125 150
40 60 80 100 120 140 160 °C
Ambient Temperature
(%)
EXAMPLE OF APPLICATIONS
An Application of Type MU (input/feedback resistors for amplifiers)
Because the input and the feedback resistors are incorporated into one
single element, amplification is not affected by temperature change.
www.alpha-elec.co.jp
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For any questions, contact
sales-alpha@alpha-elec.co.jp
Document No.: 67005
Revision: 01-Jun-2017
MU Series
PERFORMANCE
Parameters
Maximum Rated Operating Temperature
Working Temperature Range
Thermal Shock
Overload
Test Condition
ALPHA
ALPHA Typical
Specification
Test Data
Δ
R
Δ
Ratio
Δ
R
Δ
Ratio
125°C
–65°C to +150°C
±0.05%
±0.02%
±0.01%
±0.005%
±0.05%
±0.02%
±0.01%
±0.005%
±0.05%
±0.05%
±0.02%
±0.02%
±0.01%
±0.01%
±0.005%
±0.005%
–65°C/30 min.
↔
+150°C/30 min., 5 cycles
Rated Voltage x 2.5, 5 sec.
Low Temperature Storage and Operation –65°C, No Load, 24 hrs.
→
Rated Voltage, 45 min.
Substrate Bending Test
3 mm Bend 60 sec.
Dielectric Withstanding Voltage
Insulation Resistance
Resistance to Soldering Heat
Moisture Resistance
Shock
Vibration, High Frequency
Life
Storage Life
High Temperature Exposure
Atom. Pres.: AC 200V, 1 min.
DC 100V, 1 min.
260°C, 10 sec.
+65°C to –10°C, 90% to 98% RH, Rated Power, 10 cycles
(240 hrs.)
100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks
20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs.
125°C, Rated Power, 1.5 hrs. – ON, 0.5 hrs. – OFF, 2,000 hrs.
15°C to 35°C, 15% RH to 75% RH, No Load, 10,000 hrs.
150°C, No Load, 2,000 hrs.
±0.01%
±0.01%
over 10,000 MΩ
±0.05%
±0.02%
±0.05%
±0.02%
±0.02%
±0.02%
±0.05%
±0.005%
±0.05%
±0.01%
±0.01%
±0.02%
±0.005% ±0.0025%
over 10,000 MΩ
±0.01%
±0.005%
±0.03%
±0.01%
±0.01%
±0.01%
±0.03%
±0.005%
±0.005%
±0.015%
±0.0025% ±0.0025% ±0.0015%
±0.02%
±0.02%
±0.01%
TAPE AND REEL PACKAGE
(BASED ON EIA-481-1) (DIMENSIONS IN mm)
Tape Dimensions
Reel Dimensions (Reel capacity: 800 pieces/reel)
Type
MU
A
3.6
±0.2
B
3.1
±0.2
C
12.0
±0.3
D
5.5
±0.05
E
1.75
±0.1
F
8.0
±0.1
G
2.0
±0.05
H
4.0
±0.1
J
A
N
B
Dia. 13
±0.5
C
Dia. 21
±0.8
D
2
±0.5
Dia. 1.5 Dia. 178 Dia. 60
+0.1-0
±2
min.
W1
12.4
+2.0-0
W2
18.4
max.
r
1.0
±0.5
PRECAUTION IN USING FACE-BONDED CHIP RESISTOR (DIMENSIONS IN mm)
1. Storage
Storage condition or environment may adversely affect solderability of
the exterior terminals. Do not store in high temperature and humidity.
The recommended storage environment is lower than 40°C, has less
than 70% RH humidity and is free from harmful gases such as sulphur
and chlorine.
2. Caution in Soldering
➊
Hand Soldering
Hand soldering is applicable
as shown at right.
Recommended
• Temp. of lron Tip: 240°C to 270°C
• Power of lron: 20W or less
• Diameter of Tip: Dia. 3 mm max.
➋
Solder Reflow in Furnace
Recommended
• Peak Temperature: 250°C +0°C/-5°C
• Holding time: 10 sec. max.
• To cool gradually at room temperature
❸
Dipping in Solder (Wave or Still)
Recommended
• Temp. of Solder: 240°C to 250°C
• Length of Dipping: 3 to 4 seconds
• To cool gradually at room temperature
➍
Other
Corrosion-free flux, such as rosin, is recommended. Do not apply
pressure to the molded housing immediately after soldering.
3. Cleaning
Use volatile cleaner such as methylalcohol or propylalcohol.
4. Circuit Board Design
The dimensions of solder land must be determined in conformity
with the size of resistors and with the soldering method. They are also
subject to the mounting machine and the material of the substrate.
See example below.
Terminal
1.6±0.1
0.7±0.1
0.7±0.1
1.4±0.1
Terminal
MU
Solder Land
0.9±0.1
2.5±0.1
Circuit Board
When parts are mounted on a board in high density, solder can possibly
Dimensions in mm
attach to the resistors in an excessive amount to affect performance or
reliability of the resistors. To prevent this effect, the use of solder resist is
recommended to isolate solder lands.
Document No.: 67005
Revision: 01-Jun-2017
For any questions, contact
sales-alpha@alpha-elec.co.jp
www.alpha-elec.co.jp
11
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