IC ADC 12BIT 1.5MSPS SAR 52QFN
参数名称 | 属性值 |
位数 | 12 |
采样率(每秒) | 1.5M |
输入数 | 8 |
输入类型 | 差分 |
数据接口 | LVDS - 并联,SPI |
配置 | S/H-MUX-ADC |
无线电 - S/H:ADC | 2:1 |
A/D 转换器数 | 4 |
架构 | SAR |
参考类型 | 外部, 内部 |
电压 - 电源,模拟 | 3.13 V ~ 3.47 V,5V |
电压 - 电源,数字 | 3.13 V ~ 3.47 V,5V |
特性 | 同步采样 |
工作温度 | -40°C ~ 85°C |
封装/外壳 | 52-WFQFN 裸露焊盘 |
供应商器件封装 | 52-QFN(7x8) |
LTC2320IUKG-12#TRPBF | LTC2320CUKG-12#PBF | LTC2320IUKG-12#PBF | LTC2320CUKG-12#TRPBF | LTC2320HUKG-12#TRPBF | LTC2320HUKG-12#PBF | |
---|---|---|---|---|---|---|
描述 | IC ADC 12BIT 1.5MSPS SAR 52QFN | IC ADC 12BIT 1.5MSPS SAR 52QFN | IC ADC 12BIT 1.5MSPS SAR 52QFN | IC ADC 12BIT 1.5MSPS SAR 52QFN | IC ADC 12BIT 1.5MSPS SAR 52QFN | IC ADC 12BIT 1.5MSPS SAR 52QFN |
位数 | 12 | 12 | 12 | 12 | 12 | 12 |
Brand Name | - | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology |
是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 |
零件包装代码 | - | QFN | QFN | - | QFN | QFN |
包装说明 | - | HVQCCN, | HVQCCN, | - | HVQCCN, | HVQCCN, |
针数 | - | 52 | 52 | - | 52 | 52 |
制造商包装代码 | - | UKG | UKG | - | UKG | UKG |
Reach Compliance Code | - | compliant | compliant | - | compliant | compliant |
最大模拟输入电压 | - | 2.064 V | 2.064 V | - | 2.064 V | 2.064 V |
最小模拟输入电压 | - | -2.034 V | -2.034 V | - | -2.034 V | -2.034 V |
最长转换时间 | - | 0.45 µs | 0.45 µs | - | 0.45 µs | 0.45 µs |
转换器类型 | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | - | R-PQCC-N52 | R-PQCC-N52 | - | R-PQCC-N52 | R-PQCC-N52 |
长度 | - | 8 mm | 8 mm | - | 8 mm | 8 mm |
最大线性误差 (EL) | - | 0.0244% | 0.0244% | - | 0.0244% | 0.0244% |
模拟输入通道数量 | - | 8 | 8 | - | 8 | 8 |
功能数量 | - | 1 | 1 | - | 1 | 1 |
端子数量 | - | 52 | 52 | - | 52 | 52 |
最高工作温度 | - | 70 °C | 85 °C | - | 125 °C | 125 °C |
输出位码 | - | BINARY | BINARY | - | BINARY | BINARY |
输出格式 | - | SERIAL | SERIAL | - | SERIAL | SERIAL |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | HVQCCN | HVQCCN | - | HVQCCN | HVQCCN |
封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
采样速率 | - | 1.5 MHz | 1.5 MHz | - | 1.5 MHz | 1.5 MHz |
采样并保持/跟踪并保持 | - | SAMPLE | SAMPLE | - | SAMPLE | SAMPLE |
座面最大高度 | - | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm |
标称供电电压 | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
表面贴装 | - | YES | YES | - | YES | YES |
技术 | - | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | - | COMMERCIAL | INDUSTRIAL | - | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
端子节距 | - | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | - | QUAD | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 7 mm | 7 mm | - | 7 mm | 7 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved