Preliminary
‡
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Features
NAND Flash and Mobile LPDRAM
152-Ball Package-on-Package (PoP)
Combination Memory (TI OMAP™)
MT29C Family
Current production part numbers: See Table 1 on page 3
Features
•
•
•
•
•
•
Figure 1:
PoP Block Diagram
Micron
®
NAND Flash and Mobile LPDRAM
components
RoHS-compliant, “green” package
Separate NAND Flash and Mobile LPDRAM
interfaces
Space-saving package-on-package combination
Low-voltage operation (1.70–1.95V)
Industrial temperature range: –40°C to +85°C
NAND Flash
Power
NAND Flash
Device
NAND Flash
Interface
NAND Flash-Specific Features
• Organization
–
Page size
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
–
Block size: 64 pages (128K + 4K bytes)
LP-DRAM Power
LP-DRAM
Device
LP-DRAM Interface
Mobile LPDRAM-Specific Features
•
•
•
•
•
•
•
•
No external voltage reference required
No minimum clock rate requirement
1.8V LVCMOS-compatible inputs
Programmable burst lengths
Partial-array self refresh (PASR)
Deep power-down (DPD) mode
Selectable output drive strength
STATUS REGISTER READ (SRR) supported
1
Options
• LP-DRAM
166 MHz CL3
2
133 MHz CL3
Marking
-6
-75
Notes: 1. Contact factory for remapped SRR output.
2. CL = CAS (READ) latency.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Part Numbering Information – 152-Ball PoP
Part Numbering Information – 152-Ball PoP
Micron NAND Flash and LPDRAM devices are available in different configurations and
densities.
Figure 2:
152-Ball Part Number Chart
MT 29C 1G 24M
Micron Technology
Product Family
29C = NAND + LPDRAM MCP
A
C
J
A
CG
–x
IT
ES
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
NAND Density
1G = 1Gb
2G = 2Gb
4G = 4Gb
Operating Temperature Range
IT = Industrial (–40° to +85°C)
LPDRAM Self Refresh Current
Blank = Standard
LPDRAM Density
12M = 512Mb
24M = 1024Mb
48M = 2048Mb
LPDRAM Access Time
–6 166 MHz CL3
–75 133 MHz CL3
Operating Voltage Range
A = 1.8V (1.70–1.95V)
Package Codes
CA = 152-ball PoP VFBGA (14 x 14 x 0.9mm)
CG = 152-ball PoP VFBGA (14 x 14 x 1.0mm)
JQ = 152-ball PoP TFBGA (14 x 14 x 1.1mm)
NAND Flash Configuration
Width
Density
Generation
C
D
J
K
N
P
U
V
x8
x16
x8
x16
x8
x16
x8
x16
1Gb
1Gb
2Gb
2Gb
4Gb
4Gb
1Gb
1Gb
First
First
Second
Second
First
First
Second
Second
Chip Count
LPDRAM Configuration
Type
Width
Density
Generation
CE#, CS#
Chip Count
A
B
C
D
1, 1
1, 1
1, 2
1, 2
1 NAND, 1 DRAM
2 NAND, 1 DRAM
1 NAND, 2 DRAM
2 NAND, 2 DRAM
J
L
N
R
DDR
DDR
DDR
DDR
x16
x32
x16
x32
1Gb
1Gb
512Mb
512Mb
First
First
Second
Second
Note:
Not all possible combinations are available. Contact factory for availability.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Device Marking
Table 1:
Production Part Numbers
NAND Product
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H32M32LFJG-6 IT
MT46H32M32LFJG-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
MT46H16M32LFCM-6 IT
LPDDR Product
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F4G16ABCWC-ET
MT29F1G16ABBHC-ET
MT29F1G16ABBHC-ET
MT29F2G16ABDHC-ET
MT29F2G16ABDHC-ET
MT29F1G08ABCHC-ET
MT29F1G08ABCHC-ET
MT29F1G16ABCHC-ET
MT29F1G16ABCHC-ET
Physical Part
Marking
JW399
JW400
JW297
JW296
JW226
JW227
JW188
JW189
JW385
JW384
JW375
JW374
Part Number
MT29C4G48MAPLCCA-6 IT
MT29C4G48MAPLCCA-75 IT
MT29C4G48MAPLCJQ-6 IT
MT29C4G48MAPLCJQ-75 IT
MT29C1G12MADRACG-6 IT
MT29C1G12MADRACG-75 IT
MT29C2G24MAKLACG-6 IT
MT29C2G24MAKLACG-75 IT
MT29C1G12MAURACA-6 IT
MT29C1G12MAURACA-75 IT
MT29C1G12MAVRACA-6 IT
MT29C1G12MAVRACA-75 IT
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the
top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanu-
meric code is used. The abbreviated device marks are cross-referenced to the Micron
part numbers at the FBGA Part Marking Decoder site:
www.micron.com/decoder.
To
view the location of the abbreviated mark on the device, refer to customer service note
CSN-11, “Product Mark/Label,” at
www.micron.com/csn.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
General Description
General Description
Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM
devices in a single MCP. These products target mobile applications with low-power,
high-performance, and minimal package-footprint design requirements. The NAND
Flash and Mobile LPDRAM devices are also members of the Micron discrete memory
products portfolio.
The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no
shared address, control, data, or power balls). This bus architecture supports an opti-
mized interface to processors with separate NAND Flash and Mobile LPDRAM buses.
The NAND Flash and Mobile LPDRAM devices have separate core power connections
and share a common ground (i.e., V
SS
is tied together on the two devices).
The bus architecture of this device also supports separate NAND Flash and Mobile
LPDRAM functionality without concern for device interaction. Operational characteris-
tics for the NAND Flash and Mobile LPDRAM devices are found in the standard Micron
data sheets for each of the discrete devices.
For device specifications and complete Micron NAND Flash features documentation,
please refer to the component data sheet at
www.micron.com/products/nand,
or con-
tact your local Micron sales office.
For device specifications and complete Mobile LPDRAM features documentation,
please refer to the component data sheet at
www.micron.com/products/mobiledram,
or
contact your local Micron sales office.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Preliminary
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Ball Assignments and Descriptions
Ball Assignments and Descriptions
Figure 3:
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
NC
NC
V
SSQ
NC
NC
V
SSQ
NC
NC
V
DD
WE#
NC
NC
NC
NC
NC
NC
I/O1
I/O3
CE1#
NC
NC
1
2
NC
NC
NC
NC
NC
V
DDQ
NC
V
SS
NC
NC
RE#
V
SS
V
CC
NC
V
SS
V
CC
I/O0
I/O2
LOCK
NC
NC
2
I/O6
I/O4
3
I/O7
I/O5
4
WP#
NC
5
V
SS
V
CC
6
V
CC
V
SS
7
NC
CE0#
8
NC
ALE
9
R/B#
CLE
10
V
SS
V
DD
11
A14
TQ
12
CKE1
V
SS
13
V
DD
V
DDQ
14
CKE0
A13
15
A10
V
SSQ
16
V
SS
V
DD
17
WE#
BA0
18
V
SSQ
V
DDQ
19
152-Ball VFBGA Ball Assignments (NAND x8; LPDDR x16)
3
V
DDQ
NC
4
LDM
NC
5
DQ5
V
DDQ
6
DQ7
DQ1
7
V
SSQ
DQ6
8
DQ2
LDQS
9
DQ4
DQ3
10
DQ8
DQ0
11
DQ11
12
CK
13
V
SS
CK#
14
UDM
15
16
17
18
NC
19
NC
NC
20
NC
NC
NC
NC
NC
V
SSQ
A0
V
SS
A2
A1
V
DDQ
A7
A8
V
SS
A5
CS1#
CAS#
BA1
V
SSQ
NC
NC
20
21
NC
NC
NC
NC
NC
V
DDQ
NC
V
DD
A3
A9
V
SSQ
A6
A11
V
DD
A12
CS0#
A4
RAS#
V
DDQ
NC
NC
21
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
V
DDQ
DQ13 DQ12
V
DD
DQ9 DQ10
V
SSQ
UDQS
DQ15 DQ14
Top View – Ball Down
NAND
LPDDR
Supply
Ground
Note:
Contact factory for availability of x16 LPDDR configuration.
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
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