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412185

产品描述96SC C502 5C 0.56MM 0.25KG.022"
产品类别工具与设备   
文件大小74KB,共3页
制造商Multicore
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412185概述

96SC C502 5C 0.56MM 0.25KG.022"

412185规格参数

参数名称属性值
类型焊线
直径0.022"(0.56mm)
焊剂类型免清洁
线规23 AWG,24 SWG
形式线轴,8.8 盎司(250g)
保质期不适用

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Technical Data Sheet
LOCTITE C 502
September
-2014
PRODUCT DESCRIPTION
LOCTITE C 502 provides the following product characteristics:
Technology
Activity
Product Benefits
Solder wire - Cored
Medium
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Mild odor
• Pb-free and SnPb alloys available
ROM1
Soldering
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with LOCTITE C 502 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply LOCTITE C 502 flux cored wire to a part of the joint
surface away from the soldering iron and allow to form a
joint fillet. This will be virtually instantaneous. Do not
apply excessive solder to the joint as this will not improve
joint integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
LOCTITE C 502 flux cored solder wire has been formulated to
leave amber flux residues and resist spitting and fuming. In
most industrial and consumer electronics applications,
cleaning will not be required. The product may, therefore, be
used to complement a no-clean wave soldering or reflow
process or to allow repairs to cleaned boards without the need
for a second cleaning process. In high-reliability applications,
the residues should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
LOCTITE C 502 cored solder wire has been specially
formulated to complement no clean wave and reflow soldering
processes. LOCTITE C 502 is also well suited for soldering
applications requiring high melting temperature alloys.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
• SN63
• SN60
• SN62
• 96SC (SAC387)
• 97SC (SAC305)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
156 to 172 mg KOH/g
0.2%
2.7
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
ALLOYS:
The alloys used in LOCTITE C 502 cored solder wires conform
to the purity requirements of the common national and
international standards.
FLUX:
LOCTITE C 502 solid flux is based on modified rosin and
carefully selected activators. In practice they exhibit a mild
rosin odor and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with LOCTITE C 502 does not require any special
methods or deviation from standard hand soldering practices.

 
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