IC REG QD BCK/LINEAR SYNC 16TQFN
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC16,.12SQ,20 |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER |
控制模式 | VOLTAGE-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 5.5 V |
最小输入电压 | 1.7 V |
标称输入电压 | 3.6 V |
JESD-30 代码 | S-XQCC-N16 |
JESD-609代码 | e3 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 2 A |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC16,.12SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
表面贴装 | YES |
切换器配置 | BUCK |
最大切换频率 | 1500 kHz |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
MAX8668ETEA+T | MAX8667 | MAX8667ETEAA+ | MAX8667ETEHR+ | MAX8668ETEQ+T | MAX8667ETEAB+T | MAX8668ETEV+T | MAX8668ETEP+T | MAX8668ETEU+ | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC REG QD BCK/LINEAR SYNC 16TQFN | 1.5MHz Dual Step-Down DC-DC Converters with Dual LDOs and Individual Enables | 1.5MHz Dual Step-Down DC-DC Converters with Dual LDOs and Individual Enables | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | QFN | - | QFN | QFN | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC16,.12SQ,20 | - | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 |
针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | - | compli | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER | - | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER |
控制模式 | VOLTAGE-MODE | - | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小输入电压 | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称输入电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
JESD-30 代码 | S-XQCC-N16 | - | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 |
JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出电流 | 2 A | - | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A |
封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC16,.12SQ,20 | - | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
切换器配置 | BUCK | - | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK |
最大切换频率 | 1500 kHz | - | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
Factory Lead Time | - | - | 1 week | 1 week | 20 weeks | - | 6 weeks | 1 week | 6 weeks |
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