IC REG QD BCK/LINEAR SYNC 16TQFN
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER |
| 控制模式 | VOLTAGE-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 5.5 V |
| 最小输入电压 | 1.7 V |
| 标称输入电压 | 3.6 V |
| JESD-30 代码 | S-XQCC-N16 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 2 A |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 表面贴装 | YES |
| 切换器配置 | BUCK |
| 最大切换频率 | 1500 kHz |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| MAX8668ETEV+T | MAX8667 | MAX8667ETEAA+ | MAX8667ETEHR+ | MAX8668ETEQ+T | MAX8667ETEAB+T | MAX8668ETEA+T | MAX8668ETEP+T | MAX8668ETEU+ | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC REG QD BCK/LINEAR SYNC 16TQFN | 1.5MHz Dual Step-Down DC-DC Converters with Dual LDOs and Individual Enables | 1.5MHz Dual Step-Down DC-DC Converters with Dual LDOs and Individual Enables | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN | IC REG QD BCK/LINEAR SYNC 16TQFN |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | QFN | - | QFN | QFN | QFN | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 | - | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | - | compli | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | - | 1 week | 1 week | 20 weeks | - | - | 1 week | 6 weeks |
| 模拟集成电路 - 其他类型 | DUAL SWITCHING CONTROLLER | - | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER | DUAL SWITCHING CONTROLLER |
| 控制模式 | VOLTAGE-MODE | - | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
| 控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小输入电压 | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称输入电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| JESD-30 代码 | S-XQCC-N16 | - | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 |
| JESD-609代码 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 2 A | - | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 | - | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 切换器配置 | BUCK | - | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK | BUCK |
| 最大切换频率 | 1500 kHz | - | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | TIN | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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