IC REG CTRLR
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | HVQCCN, LCC28,.2SQ,20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 13 weeks |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
控制模式 | CURRENT-MODE |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 42 V |
最小输入电压 | 4.5 V |
标称输入电压 | 12 V |
JESD-30 代码 | S-PQCC-N28 |
JESD-609代码 | e3 |
长度 | 5 mm |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC28,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 1 mm |
表面贴装 | YES |
切换器配置 | BOOST |
最大切换频率 | 2100 kHz |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 5 mm |
MCP19125T-E/MQ | MKT1820522/064-W | MCP19124-E/MJ | MCP19125-E/MQ | ADM00745 | MCP19125-E/MQVAO | MCP19125T-E/MQVAO | |
---|---|---|---|---|---|---|---|
描述 | IC REG CTRLR | CAPACITOR, METALLIZED FILM, POLYESTER, 63 V, 2.2 uF, THROUGH HOLE MOUNT, RADIAL LEADED | DIGITALLY ENHANCED POWER, VOLTAG | DIGITALLY ENHANCED POWER, VOLTAG | FLYBACK BATTERY CHARGER EVAL BD | Power Supply Management Circuit, Adjustable, 1 Channel | Power Supply Management Circuit, Adjustable, 1 Channel |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - | - |
厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | HVQCCN, LCC28,.2SQ,20 | - | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC28,.2SQ,20 | - | HVQCCN, | HVQCCN, |
Reach Compliance Code | compliant | unknown | compliant | compliant | - | compliant | compliant |
模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | S-PQCC-N28 | - | S-PQCC-N24 | S-PQCC-N28 | - | S-XQCC-N28 | S-XQCC-N28 |
长度 | 5 mm | - | 4 mm | 5 mm | - | 5 mm | 5 mm |
功能数量 | 1 | - | 1 | 1 | - | 1 | 1 |
端子数量 | 28 | - | 24 | 28 | - | 28 | 28 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | - | HVQCCN | HVQCCN |
封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 1 mm | - | 0.9 mm | 1 mm | - | 1 mm | 1 mm |
表面贴装 | YES | - | YES | YES | - | YES | YES |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD | - | QUAD | QUAD |
宽度 | 5 mm | - | 4 mm | 5 mm | - | 5 mm | 5 mm |
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