IC MULTIPLEXER 8X1 18DIP
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DIP |
包装说明 | DIP, DIP18,.3 |
针数 | 18 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDIP-T18 |
JESD-609代码 | e3 |
长度 | 22.86 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -8 V |
负电源电压最小值(Vsup) | -3 V |
标称负供电电压 (Vsup) | -5 V |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 18 |
通态电阻匹配规范 | 16 Ω |
最大通态电阻 (Ron) | 100 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP18,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5/+-5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.572 mm |
最大信号电流 | 0.03 A |
最大供电电流 (Isup) | 0.03 mA |
最大供电电压 (Vsup) | 8 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
最长断开时间 | 300 ns |
最长接通时间 | 400 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
MAX349CPN+ | MAX349-MAX350 | MAX350 | MAX349C/D | MAX349 | MAX350CWN+ | MAX350CWN+T | MAX349CAP+T | |
---|---|---|---|---|---|---|---|---|
描述 | IC MULTIPLEXER 8X1 18DIP | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | IC MUX LV 8CH DUAL 4CH 18-SOIC | IC MUX LV 8CH DUAL 4CH 18-SOIC | IC MULTIPLEXER 8X1 20SSOP |
功能数量 | 1 | 1 | 1 | 1 | 1 | 2 | 2 | 1 |
端子数量 | 18 | 20 | 20 | 17 | 20 | 18 | 18 | 20 |
表面贴装 | NO | Yes | Yes | YES | Yes | YES | YES | YES |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL |
是否无铅 | 不含铅 | - | - | 含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | - | 不符合 | - | 符合 | 符合 | 符合 |
零件包装代码 | DIP | - | - | DIE | - | SOIC | SOIC | SSOP |
包装说明 | DIP, DIP18,.3 | - | - | DIE-17 | - | SOP, SOP18,.4 | SOP, SOP18,.4 | SSOP-20 |
针数 | 18 | - | - | 17 | - | 18 | 18 | 20 |
Reach Compliance Code | compliant | - | - | _compli | - | compliant | compliant | compliant |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | - | SINGLE-ENDED MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDIP-T18 | - | - | R-XUUC-N17 | - | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G20 |
JESD-609代码 | e3 | - | - | e0 | - | e3 | e3 | e3 |
湿度敏感等级 | 1 | - | - | 1 | - | 1 | 1 | 1 |
标称负供电电压 (Vsup) | -5 V | - | - | -5 V | - | -5.5 V | -5.5 V | -5.5 V |
信道数量 | 8 | - | - | 8 | - | 4 | 4 | 8 |
通态电阻匹配规范 | 16 Ω | - | - | 16 Ω | - | 16 Ω | 16 Ω | 16 Ω |
最大通态电阻 (Ron) | 100 Ω | - | - | 100 Ω | - | 100 Ω | 100 Ω | 100 Ω |
最高工作温度 | 70 °C | - | - | 70 °C | - | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | - | - | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | - | - | DIE | - | SOP | SOP | SSOP |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | - | UNCASED CHIP | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | - | - | 240 | - | 260 | NOT SPECIFIED | 260 |
认证状态 | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | - | - | 5 V | - | 5.5 V | 5.5 V | 5.5 V |
最长断开时间 | 300 ns | - | - | 300 ns | - | 150 ns | 150 ns | 150 ns |
最长接通时间 | 400 ns | - | - | 400 ns | - | 275 ns | 275 ns | 275 ns |
技术 | CMOS | - | - | CMOS | - | CMOS | CMOS | CMOS |
端子面层 | Matte Tin (Sn) | - | - | TIN LEAD | - | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | - | - | 1 | - | 1 | 1 | 1 |
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