IC MULTIPLEXER 8X1 20SSOP
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 8 weeks |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e3 |
| 长度 | 7.2 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -5.5 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 通态电阻匹配规范 | 16 Ω |
| 最大通态电阻 (Ron) | 100 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5/+-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.99 mm |
| 最大信号电流 | 0.03 A |
| 最大供电电流 (Isup) | 0.03 mA |
| 标称供电电压 (Vsup) | 5.5 V |
| 表面贴装 | YES |
| 最长断开时间 | 150 ns |
| 最长接通时间 | 275 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.29 mm |
| Base Number Matches | 1 |
| MAX349CAP+T | MAX349-MAX350 | MAX350 | MAX349C/D | MAX349 | MAX350CWN+ | MAX350CWN+T | MAX349CPN+ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC MULTIPLEXER 8X1 20SSOP | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO20 | IC MUX LV 8CH DUAL 4CH 18-SOIC | IC MUX LV 8CH DUAL 4CH 18-SOIC | IC MULTIPLEXER 8X1 18DIP |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 2 | 2 | 1 |
| 端子数量 | 20 | 20 | 20 | 17 | 20 | 18 | 18 | 18 |
| 表面贴装 | YES | Yes | Yes | YES | Yes | YES | YES | NO |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | DUAL |
| 是否无铅 | 不含铅 | - | - | 含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 不符合 | - | 符合 | 符合 | 符合 |
| 零件包装代码 | SSOP | - | - | DIE | - | SOIC | SOIC | DIP |
| 包装说明 | SSOP-20 | - | - | DIE-17 | - | SOP, SOP18,.4 | SOP, SOP18,.4 | DIP, DIP18,.3 |
| 针数 | 20 | - | - | 17 | - | 18 | 18 | 18 |
| Reach Compliance Code | compliant | - | - | _compli | - | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | - | SINGLE-ENDED MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G20 | - | - | R-XUUC-N17 | - | R-PDSO-G18 | R-PDSO-G18 | R-PDIP-T18 |
| JESD-609代码 | e3 | - | - | e0 | - | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | - | - | 1 | - | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -5.5 V | - | - | -5 V | - | -5.5 V | -5.5 V | -5 V |
| 信道数量 | 8 | - | - | 8 | - | 4 | 4 | 8 |
| 通态电阻匹配规范 | 16 Ω | - | - | 16 Ω | - | 16 Ω | 16 Ω | 16 Ω |
| 最大通态电阻 (Ron) | 100 Ω | - | - | 100 Ω | - | 100 Ω | 100 Ω | 100 Ω |
| 最高工作温度 | 70 °C | - | - | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | - | DIE | - | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | - | UNCASED CHIP | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | - | - | 240 | - | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5.5 V | - | - | 5 V | - | 5.5 V | 5.5 V | 5 V |
| 最长断开时间 | 150 ns | - | - | 300 ns | - | 150 ns | 150 ns | 300 ns |
| 最长接通时间 | 275 ns | - | - | 400 ns | - | 275 ns | 275 ns | 400 ns |
| 技术 | CMOS | - | - | CMOS | - | CMOS | CMOS | CMOS |
| 端子面层 | Tin (Sn) | - | - | TIN LEAD | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | - | - | 1 | - | 1 | 1 | 1 |
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