Military 128K x 8 CMOS EPROM
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | 0.600 INCH, CERDIP-32 |
| 针数 | 32 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T32 |
| JESD-609代码 | e0 |
| 长度 | 42.295 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 128KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP32,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.72 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| WS27C010L-15DMB | WS27C010L-20CMB | WS27C010L-20DMB | WS27C010L-17CMB | WS27C010L-17DMB | WS27C010L-15CMB | WS27C010L | WS27C010L-12CMB | WS27C010L-12DMB | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM | Military 128K x 8 CMOS EPROM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 零件包装代码 | DIP | QFJ | DIP | QFJ | DIP | QFJ | - | QFJ | DIP |
| 包装说明 | 0.600 INCH, CERDIP-32 | CERAMIC, LLCC-32 | 0.600 INCH, CERDIP-32 | CERAMIC, LLCC-32 | 0.600 INCH, CERDIP-32 | CERAMIC, LLCC-32 | - | WQCCN, LCC32,.45X.55 | 0.600 INCH, CERDIP-32 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli | - | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | 200 ns | 200 ns | 170 ns | 170 ns | 150 ns | - | 120 ns | 120 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON |
| JESD-30 代码 | R-GDIP-T32 | R-CQCC-N32 | R-GDIP-T32 | R-CQCC-N32 | R-GDIP-T32 | R-CQCC-N32 | - | R-CQCC-N32 | R-GDIP-T32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 长度 | 42.295 mm | 13.97 mm | 42.295 mm | 13.97 mm | 42.295 mm | 13.97 mm | - | 13.97 mm | 42.295 mm |
| 内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | - | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | - | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | - | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | - | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | - | 128KX8 | 128KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP | WQCCN | WDIP | WQCCN | WDIP | WQCCN | - | WQCCN | WDIP |
| 封装等效代码 | DIP32,.6 | LCC32,.45X.55 | DIP32,.6 | LCC32,.45X.55 | DIP32,.6 | LCC32,.45X.55 | - | LCC32,.45X.55 | DIP32,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | - | CHIP CARRIER, WINDOW | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | MIL-STD-883 Class B | MIL-STD-883 Class B |
| 座面最大高度 | 5.72 mm | 3.3 mm | 5.72 mm | 3.3 mm | 5.72 mm | 3.3 mm | - | 3.3 mm | 5.72 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | - | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES | - | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | - | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD | - | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | - | 11.43 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | 1 |
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