UM10754
OM13491, OM13492, OM13493, OM13494, OM13495,
OM13496, OM13497 Breakout Board
Rev. 1 — 23 October 2013
User manual
Document information
Info
Content
Keywords
Abstract
Fm+, I2C-bus, Surface Mount Package, Breakout Board, DIP Adapter,
surface mount package
Technical information for breakout boards allowing I C-bus surface
mount components to be easily evaluated
2
NXP Semiconductors
UM10754
Breakout Board / DIP Adapter
Revision history
Rev
Date
1
20131023
Description
Initial Release
Contact information
For more information, please visit:
http://www.nxp.com
For sales office addresses, please send an email to:
salesaddresses@nxp.com
UM10754
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
User manual
Rev. 1 — 23 October 2013
2 of 25
NXP Semiconductors
UM10754
Breakout Board / DIP Adapter
1. Introduction
The Breakout Boards OM13491, OM13492, OM13493, OM13494, OM13495, OM13496,
OM13497 permit surface mounted I2C-bus components to be easily evaluated by
translating surface mount packages to a leaded package format with 100mil pin pitch.
2. Key features
A wide variety of package types:
Almost all the surface mount package types used by NXP I2C-bus products are
supported.
Table 1.
Package Name to SOT drawing number conversion
SOT Number
Package Name
SO8
VSSOP8
XQFN8
HWSON8
MSOP8
MSOP10
HVSON10
XSON8U
TSSOP8
HVSON8
WLCSP6
TSOP6SOT457
DHVQFN24
DHVQFN20
DHVQFN16
DHVQFN14
HVQFN24
HVQFN20
SOT96-1
SOT765-1
SOT902-1
SOT1069-2
SOT505-1
SOT552-1
SOT650-1
SOT996-2
SOT530-1
SOT908-1
PCT2202UK
SOT1353-1
SOT616-1
SOT662-1
SOT763-1
SOT762-1
SOT616-1
SOT662-1
UM10754
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
User manual
Rev. 1 — 23 October 2013
3 of 25
NXP Semiconductors
UM10754
Breakout Board / DIP Adapter
SOT Number
Package Name
HVQFN16
HVQFN14
TSSOP24
TSSOP20
TSSOP16
TSSOP14
QSOP16
XFBGA16
XQFN16
TSSOP28
VFBGA24
XFBGA24
HTSSOP24
SOT758-1
SOT629-1
SOT355-1
SOT360-1
SOT403-1
SOT402-1
SOT519-1
SOT1354-1
SOT1161-1
SOT361-1
SOT1199-1
SOT1342-1
SOT1172-2
Translation to leaded pins:
The breakout boards translate the surface mount package to a leaded package with 100
mil pitch, allowing quick and easy bread boarding in standard configurations.
3. Quick overview of the breakout board concept
There are seven different breakout boards, each supporting a number of different surface
mount packages. If one wishes to evaluate a device, simply solder a surface mount
device to the appropriate site and break out the site from the panel by cutting through the
small tabs holding each board in place. If one is using a universal breadboard for
evaluation, solder header pins to the outside pads, allowing one to insert the device into
the breadboard.
For a more permanent connection, one can simply solder hookup wire to the outside
pads.
UM10754
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
User manual
Rev. 1 — 23 October 2013
4 of 25
NXP Semiconductors
UM10754
Breakout Board / DIP Adapter
Fig 1.
Breakout board with headers assembly
Fig 2.
Panel A – consisting of six positions each of SO8, VSSOP8, XQFN8, 2xHWSON8
and 2xMSOP8
UM10754
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
User manual
Rev. 1 — 23 October 2013
5 of 25
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