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MX29GL320ELXFI-70G: 产品描述IC FLASH 32M PARALLEL 64LFBGA; 产品类别存储存储; 文件大小1MB，共77页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX29GL320ELXFI-70G概述

IC FLASH 32M PARALLEL 64LFBGA

MX29GL320ELXFI-70G规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	BGA
包装说明	LBGA, BGA64,8X8,40
针数	64
Reach Compliance Code	unknown
ECCN代码	3A991.B.1.A
Factory Lead Time	16 weeks
最长访问时间	70 ns
备用内存宽度	8
命令用户界面	YES
通用闪存接口	YES
数据轮询	YES
JESD-30 代码	R-PBGA-B64
JESD-609代码	e1
长度	13 mm
内存密度	33554432 bit
内存集成电路类型	FLASH
内存宽度	16
功能数量	1
部门数/规模	64
端子数量	64
字数	2097152 words
字数代码	2000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	2MX16
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA64,8X8,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
页面大小	8/16 words
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
电源	3/3.3 V
编程电压	3 V
认证状态	Not Qualified
就绪/忙碌	YES
座面最大高度	1.4 mm
部门规模	64K
最大待机电流	0.0001 A
最大压摆率	0.1 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
切换位	YES
类型	NOR TYPE
宽度	11 mm

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MX29GL320E T/B

MX29GL320E H/L

MX29GL320E T/B, MX29GL320E H/L

DATASHEET

P/N:PM1509

REV. 1.5, OCT. 21, 2015

MX29GL320E T/B

MX29GL320E H/L

Contents

FEATURES ............................................................................................................................................................. 5

PIN CONFIGURATION for MX29GL320E T/B ....................................................................................................... 6

PIN CONFIGURATION for MX29GL320E H/L ....................................................................................................... 7

PIN DESCRIPTION ................................................................................................................................................. 8

BLOCK DIAGRAM.................................................................................................................................................. 9

BLOCK DIAGRAM DESCRIPTION ...................................................................................................................... 10

BLOCK STRUCTURE........................................................................................................................................... 11

Table 1-1. MX29GL320ET SECTOR ARCHITECTURE .............................................................................11

Table 1-2. MX29GL320EB SECTOR ARCHITECTURE ............................................................................ 13

Table 1-3. MX29GL320E H/L SECTOR ARCHITECTURE ........................................................................ 15

BUS OPERATION ................................................................................................................................................. 17

Table 2-1. BUS OPERATION ...................................................................................................................... 17

Table 2-2. BUS OPERATION ...................................................................................................................... 18

FUNCTIONAL OPERATION DESCRIPTION ....................................................................................................... 19

READ OPERATION .................................................................................................................................... 19

PAGE READ ............................................................................................................................................... 19

WRITE OPERATION .................................................................................................................................. 19

DEVICE RESET ......................................................................................................................................... 19

STANDBY MODE ....................................................................................................................................... 19

OUTPUT DISABLE ..................................................................................................................................... 20

BYTE/WORD SELECTION......................................................................................................................... 20

HARDWARE WRITE PROTECT ................................................................................................................ 20

ACCELERATED PROGRAMMING OPERATION ...................................................................................... 20

WRITE BUFFER PROGRAMMING OPERATION ...................................................................................... 20

SECTOR PROTECT OPERATION ............................................................................................................. 21

AUTOMATIC SELECT BUS OPERATIONS ............................................................................................... 21

SECTOR LOCK STATUS VERIFICATION ................................................................................................. 21

READ SILICON ID MANUFACTURER CODE ........................................................................................... 22

READ INDICATOR BIT (Q7) FOR SECURITY SECTOR ........................................................................... 22

INHERENT DATA PROTECTION ............................................................................................................... 22

COMMAND COMPLETION ........................................................................................................................ 22

LOW VCC WRITE INHIBIT......................................................................................................................... 22

WRITE PULSE "GLITCH" PROTECTION .................................................................................................. 22

LOGICAL INHIBIT....................................................................................................................................... 22

POWER-UP SEQUENCE ........................................................................................................................... 23

POWER-UP WRITE INHIBIT ...................................................................................................................... 23

POWER SUPPLY DECOUPLING............................................................................................................... 23

COMMAND OPERATIONS ................................................................................................................................... 24

READING THE MEMORY ARRAY ............................................................................................................. 24

P/N:PM1509

REV. 1.5, OCT. 21, 2015

MX29GL320E T/B

MX29GL320E H/L

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ..................................................................... 24

ERASING THE MEMORY ARRAY.............................................................................................................. 25

SECTOR ERASE ........................................................................................................................................ 25

CHIP ERASE ............................................................................................................................................. 26

ERASE SUSPEND/RESUME ..................................................................................................................... 27

SECTOR ERASE RESUME ....................................................................................................................... 27

PROGRAM SUSPEND/RESUME .............................................................................................................. 28

PROGRAM RESUME ................................................................................................................................. 28

BUFFER WRITE ABORT ............................................................................................................................ 28

AUTOMATIC SELECT OPERATIONS ........................................................................................................ 29

AUTOMATIC SELECT COMMAND SEQUENCE ....................................................................................... 29

READ MANUFACTURER ID OR DEVICE ID ............................................................................................. 30

RESET ....................................................................................................................................................... 30

ADVANCED SECTOR PROTECTION/UN-PROTECTION......................................................................... 31

Figure 1. Advance Sector Protection/Unprotection SPB Program Algorithm .............................................. 31

Figure 2. Lock Register Program Algorithm ................................................................................................ 32

Figure 3. SPB Program Algorithm............................................................................................................... 34

SECURITY SECTOR FLASH MEMORY REGION ..................................................................................... 37

FACTORY LOCKED: SECURITY SECTOR PROGRAMMED AND PROTECTED AT THE FACTORY ..... 37

CUSTOMER LOCKABLE: SECURITY SECTOR NOT PROGRAMMED OR PROTECTED AT THE

FACTORY ................................................................................................................................................... 37

TABLE 3. COMMAND DEFINITIONS ......................................................................................................... 38

COMMON FLASH MEMORY INTERFACE (CFI) MODE ..................................................................................... 41

QUERY COMMAND AND COMMAND FLASH MEMORY INTERFACE (CFI) MODE ............................... 41

Table 4-1. CFI mode: Identification Data Values

(Note 1)

............................................................................... 41

Table 4-2. CFI mode: System Interface Data Values .................................................................................. 41

Table 4-3. CFI mode: Device Geometry Data Values ................................................................................. 42

Table 4-4. CFI mode: Primary Vendor-Specific Extended Query Data Values

........................................... 43

ELECTRICAL CHARACTERISTICS .................................................................................................................... 44

ABSOLUTE MAXIMUM STRESS RATINGS .............................................................................................. 44

OPERATING TEMPERATURE AND VOLTAGE ......................................................................................... 44

Maximum Negative Overshoot Waveform

.................................................................................................. 44

Maximum Positive Overshoot Waveform

.................................................................................................... 44

DC CHARACTERISTICS............................................................................................................................ 45

SWITCHING TEST CIRCUITS ................................................................................................................... 46

SWITCHING TEST WAVEFORMS ............................................................................................................ 46

AC CHARACTERISTICS ............................................................................................................................ 47

WRITE COMMAND OPERATION......................................................................................................................... 48

Figure 4. COMMAND WRITE OPERATION ............................................................................................... 48

READ/RESET OPERATION ................................................................................................................................. 49

Figure 5. READ TIMING WAVEFORMS ..................................................................................................... 49

Figure 6. RESET# TIMING WAVEFORM .................................................................................................. 50

P/N:PM1509

REV. 1.5, OCT. 21, 2015

MX29GL320E T/B

MX29GL320E H/L

ERASE/PROGRAM OPERATION ........................................................................................................................ 51

Figure 7. AUTOMATIC CHIP ERASE TIMING WAVEFORM ...................................................................... 51

Figure 8. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART ........................................................... 52

Figure 9. AUTOMATIC SECTOR ERASE TIMING WAVEFORM ............................................................... 53

Figure 10. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART ................................................... 54

Figure 11. ERASE SUSPEND/RESUME FLOWCHART ............................................................................ 55

Figure 12. AUTOMATIC PROGRAM TIMING WAVEFORMS..................................................................... 56

Figure 13. ACCELERATED PROGRAM TIMING DIAGRAM...................................................................... 56

Figure 14. CE# CONTROLLED WRITE TIMING WAVEFORM .................................................................. 57

Figure 15. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART ................................................... 58

Figure 16. SILICON ID READ TIMING WAVEFORM ................................................................................. 59

WRITE OPERATION STATUS .............................................................................................................................. 60

Figure 17. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) ................. 60

Figure 18. STATUS POLLING FOR WORD PROGRAM/ERASE............................................................... 61

Figure 19. STATUS POLLING FOR WRITE BUFFER PROGRAM ............................................................ 62

Figure 20. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)....................... 63

Figure 21. TOGGLE BIT ALGORITHM ....................................................................................................... 64

Figure 22. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to

word mode) ................................................................................................................................................. 65

Figure 23. PAGE READ TIMING WAVEFORM........................................................................................... 65

Figure 24. DEEP POWER DOWN MODE WAVEFORM ........................................................................... 66

Figure 25. WRITE BUFFER PROGRAM FLOWCHART ............................................................................ 67

RECOMMENDED OPERATING CONDITIONS .................................................................................................... 68

At Device Power-Up ................................................................................................................................... 68

ERASE AND PROGRAMMING PERFORMANCE ............................................................................................... 69

DATA RETENTION ............................................................................................................................................... 69

LATCH-UP CHARACTERISTICS ......................................................................................................................... 69

PIN CAPACITANCE .............................................................................................................................................. 69

ORDERING INFORMATION ................................................................................................................................. 70

PART NAME DESCRIPTION ................................................................................................................................ 71

PACKAGE INFORMATION ................................................................................................................................... 72

REVISION HISTORY ............................................................................................................................................ 76

P/N:PM1509

REV. 1.5, OCT. 21, 2015

MX29GL320ELXFI-70G

MX29GL320ELXFI-70G概述

MX29GL320ELXFI-70G规格参数

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