IC BUF NON-INVERT 3.6V 96LFBGA
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 |
| 针数 | 96 |
| 制造商包装代码 | SOT536-1 |
| Reach Compliance Code | compliant |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PBGA-B96 |
| 长度 | 13.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 4 |
| 位数 | 4 |
| 功能数量 | 8 |
| 端口数量 | 2 |
| 端子数量 | 96 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 传播延迟（tpd） | 4.7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.5 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 5.5 mm |
| Base Number Matches | 1 |
| 74LVCH32244AEC,551 | 74LVCH32244AEC-S | 74LVCH32244AEC,557 | 74LVCH32244AEC,518 | 74LVCH32244AEC/G,5 | 74LVCH32244AEC-T518 | 935277682557 | 935277682118 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC BUF NON-INVERT 3.6V 96LFBGA | 缓冲器和线路驱动器 32-bit 5V tol I/O buffer 3-S | IC BUF NON-INVERT 3.6V 96LFBGA | IC BUF NON-INVERT 3.6V 96LFBGA | IC BUF NON-INVERT 3.6V 96LFBGA | LVC/LCX/Z SERIES, OCTAL 4-BIT DRIVER, TRUE OUTPUT, PBGA96 | LVC/LCX/Z SERIES, OCTAL 4-BIT DRIVER, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 | LVC/LCX/Z SERIES, OCTAL 4-BIT DRIVER, TRUE OUTPUT, PBGA96, 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 | LFBGA, | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 | LFBGA, | LFBGA, | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT-536-1, LFBGA-96 |
| Reach Compliance Code | compliant | unknow | not_compliant | compliant | compliant | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 |
| 长度 | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm | 13.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 96 | 96 | 96 | 96 | 96 | 96 | 96 | 96 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 传播延迟（tpd） | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns |
| 座面最大高度 | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 5.5 mm | 5.5 mm | 5.5 mm | 5.5 mm | 5.5 mm | 5.5 mm | 5.5 mm | 5.5 mm |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | - | - | - |
| 针数 | 96 | 96 | 96 | 96 | 96 | - | - | - |
| 制造商包装代码 | SOT536-1 | SOT-536-1 | SOT536-1 | SOT536-1 | SOT536-1 | - | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
工业自动化与控制
Linux开发
嵌入式系统
stm32/stm8
嵌入式系统
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
