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74LVC38ADB,112: 产品描述IC GATE NAND 4CH 2-INP 14SSOP; 产品类别逻辑逻辑; 文件大小270KB，共15页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74LVC38ADB,112概述

IC GATE NAND 4CH 2-INP 14SSOP

74LVC38ADB,112规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SSOP1
包装说明	5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14
针数	14
制造商包装代码	SOT337-1
Reach Compliance Code	compliant
系列	LVC/LCX/Z
JESD-30 代码	R-PDSO-G14
JESD-609代码	e4
长度	6.2 mm
逻辑集成电路类型	NAND GATE
最大I（ol）	0.024 A
湿度敏感等级	1
功能数量	4
输入次数	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	OPEN-DRAIN
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装等效代码	SSOP14,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
包装方法	BULK PACK
峰值回流温度（摄氏度）	260
电源	3.3 V
Prop。Delay @ Nom-Sup	4.5 ns
传播延迟（tpd）	5 ns
认证状态	Not Qualified
施密特触发器	NO
座面最大高度	2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	1.2 V
标称供电电压 (Vsup)	2.7 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	5.3 mm
Base Number Matches	1

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74LVC38A

Quad 2-input NAND gate; open-drain

Rev. 4 — 4 November 2011

Product data sheet

1. General description

The 74LVC38A provides four 2-input NAND functions. The outputs are open-drain and

can be connected to other open-drain outputs to implement active-LOW wired-OR or

active-HIGH wired-AND functions.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these

devices as translators in mixed 3.3 V and 5 V applications.

2. Features and benefits



5 V tolerant inputs for interfacing with 5 V logic

Wide supply voltage range from 1.2 V to 5.5 V

CMOS low power consumption

Direct interface with TTL levels

Open-drain outputs

Complies with JEDEC standard:



JESD8-7A (1.65 V to 1.95 V



JESD8-5A (2.3 V to 2.7 V



JESD8-C/JESD36 (2.7 V to 3.6 V



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115B exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74LVC38AD

74LVC38ADB

74LVC38APW

74LVC38ABQ

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

Name

SO14

SSOP14

TSSOP14

Description

plastic small outline package; 14 leads;

body width 3.9 mm

plastic shrink small outline package; 14 leads;

body width 5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT337-1

SOT402-1

SOT762-1

Type number

DHVQFN14 plastic dual in-line compatible thermal enhanced very

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

74LVC38ADB,112相似产品对比

	74LVC38ADB,112	74LVC38APW,118	74LVC38AD,118	74LVC38ADB,118	74LVC38ABQ,115	935275105115	935271445112	935271445118
描述	IC GATE NAND 4CH 2-INP 14SSOP	IC GATE NAND 4CH 2-INP 14TSSOP	IC GATE NAND OD 4CH 2-INP 14SO	IC GATE NAND 4CH 2-INP 14SSOP	IC GATE NAND 4CH 2-INP 14DHVQFN	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
包装说明	5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14	TSSOP, TSSOP14,.25	SOP, SOP14,.25	SSOP, SSOP14,.3	HVQCCN, LCC14,.1X.12,20	HVQCCN,	4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	unknown	unknown	unknown
系列	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 代码	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14
JESD-609代码	e4	e4	e4	e4	e4	e4	e4	e4
长度	6.2 mm	5 mm	8.65 mm	6.2 mm	3 mm	3 mm	5 mm	5 mm
逻辑集成电路类型	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
功能数量	4	4	4	4	4	4	4	4
输入次数	2	2	2	2	2	2	2	2
端子数量	14	14	14	14	14	14	14	14
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SSOP	TSSOP	SOP	SSOP	HVQCCN	HVQCCN	TSSOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns
座面最大高度	2 mm	1.1 mm	1.75 mm	2 mm	1 mm	1 mm	1.1 mm	1.1 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
标称供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.5 mm	0.5 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
宽度	5.3 mm	4.4 mm	3.9 mm	5.3 mm	2.5 mm	2.5 mm	4.4 mm	4.4 mm
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-	-	-
是否Rohs认证	符合	符合	符合	符合	符合	-	-	-
零件包装代码	SSOP1	TSSOP	SOIC	SSOP1	QFN	-	-	-
针数	14	14	14	14	14	-	-	-
制造商包装代码	SOT337-1	SOT402-1	SOT108-1	SOT337-1	SOT762-1	-	-	-
最大I（ol）	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	-	-	-
湿度敏感等级	1	1	1	1	1	-	-	-
封装等效代码	SSOP14,.3	TSSOP14,.25	SOP14,.25	SSOP14,.3	LCC14,.1X.12,20	-	-	-
包装方法	BULK PACK	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-	-	-
峰值回流温度（摄氏度）	260	260	260	260	260	-	-	-
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	-	-
Prop。Delay @ Nom-Sup	4.5 ns	4.5 ns	4.5 ns	4.5 ns	4.5 ns	-	-	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-
施密特触发器	NO	NO	NO	NO	NO	-	-	-
处于峰值回流温度下的最长时间	30	30	30	30	30	-	-	-
Base Number Matches	1	1	1	1	1	1	-	-

74LVC38ADB,112

74LVC38ADB,112概述

74LVC38ADB,112规格参数

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