BOARD EVALUATION FOR ADC081S051
| 参数名称 | 属性值 |
| A/D 转换器数 | 1 |
| 位数 | 8 |
| 采样率（每秒） | 200k ~ 500k |
| 数据接口 | 串行 |
| 输入范围 | 0 ~ 5.25 V |
| 不同条件下的功率（典型值） | 8.5mW @ 500kSPS |
| 使用的 IC/零件 | ADC081S051 |
| 所含物品 | 板 |
| ADC081S051EVAL | ADC081S051CISD | ADC081S051CISDX | ADC081S051CIMF | ADC081S051CIMFX | |
|---|---|---|---|---|---|
| 描述 | BOARD EVALUATION FOR ADC081S051 | Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 | Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 | Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-SOT-23 -40 to 85 | Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-SOT-23 -40 to 85 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | SOIC | SOIC | SOT-23 | SOT-23 |
| 包装说明 | - | HVSON, SOLCC6,.1,25 | HVSON, SOLCC6,.1,25 | LSSOP, TSOP6,.11,37 | LSSOP, TSOP6,.11,37 |
| 针数 | - | 6 | 6 | 6 | 6 |
| Reach Compliance Code | - | _compli | _compli | _compli | _compli |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最长转换时间 | - | 2 µs | 2 µs | 2 µs | 2 µs |
| 转换器类型 | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | - | R-PDSO-N6 | R-PDSO-N6 | R-PDSO-G6 | R-PDSO-G6 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 长度 | - | 2.5 mm | 2.5 mm | 2.92 mm | 2.92 mm |
| 最大线性误差 (EL) | - | 0.1172% | 0.1172% | 0.1172% | 0.1172% |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 6 | 6 | 6 | 6 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | - | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVSON | HVSON | LSSOP | LSSOP |
| 封装等效代码 | - | SOLCC6,.1,25 | SOLCC6,.1,25 | TSOP6,.11,37 | TSOP6,.11,37 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | - | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz |
| 采样并保持/跟踪并保持 | - | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 1.22 mm | 1.22 mm |
| 标称供电电压 | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | - | 0.65 mm | 0.65 mm | 0.95 mm | 0.95 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 2.2 mm | 2.2 mm | 1.6 mm | 1.6 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
