|
ADC081S051CISD |
ADC081S051CISDX |
ADC081S051CIMF |
ADC081S051CIMFX |
ADC081S051EVAL |
描述 |
Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 |
Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-WSON -40 to 85 |
Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-SOT-23 -40 to 85 |
Analog to Digital Converters - ADC Single Channel, 200 to 500 ksps, 8-Bit A/D Converter 6-SOT-23 -40 to 85 |
BOARD EVALUATION FOR ADC081S051 |
位数 |
8 |
8 |
8 |
8 |
8 |
是否无铅 |
含铅 |
含铅 |
含铅 |
含铅 |
- |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
- |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
零件包装代码 |
SOIC |
SOIC |
SOT-23 |
SOT-23 |
- |
包装说明 |
HVSON, SOLCC6,.1,25 |
HVSON, SOLCC6,.1,25 |
LSSOP, TSOP6,.11,37 |
LSSOP, TSOP6,.11,37 |
- |
针数 |
6 |
6 |
6 |
6 |
- |
Reach Compliance Code |
_compli |
_compli |
_compli |
_compli |
- |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
最大模拟输入电压 |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
- |
最长转换时间 |
2 µs |
2 µs |
2 µs |
2 µs |
- |
转换器类型 |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
- |
JESD-30 代码 |
R-PDSO-N6 |
R-PDSO-N6 |
R-PDSO-G6 |
R-PDSO-G6 |
- |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
- |
长度 |
2.5 mm |
2.5 mm |
2.92 mm |
2.92 mm |
- |
最大线性误差 (EL) |
0.1172% |
0.1172% |
0.1172% |
0.1172% |
- |
湿度敏感等级 |
1 |
1 |
1 |
1 |
- |
模拟输入通道数量 |
1 |
1 |
1 |
1 |
- |
功能数量 |
1 |
1 |
1 |
1 |
- |
端子数量 |
6 |
6 |
6 |
6 |
- |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
- |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
输出位码 |
BINARY |
BINARY |
BINARY |
BINARY |
- |
输出格式 |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
- |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
封装代码 |
HVSON |
HVSON |
LSSOP |
LSSOP |
- |
封装等效代码 |
SOLCC6,.1,25 |
SOLCC6,.1,25 |
TSOP6,.11,37 |
TSOP6,.11,37 |
- |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
封装形式 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
- |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
- |
电源 |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
- |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
采样速率 |
0.5 MHz |
0.5 MHz |
0.5 MHz |
0.5 MHz |
- |
采样并保持/跟踪并保持 |
TRACK |
TRACK |
TRACK |
TRACK |
- |
座面最大高度 |
0.8 mm |
0.8 mm |
1.22 mm |
1.22 mm |
- |
标称供电电压 |
3 V |
3 V |
3 V |
3 V |
- |
表面贴装 |
YES |
YES |
YES |
YES |
- |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
- |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
端子形式 |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
- |
端子节距 |
0.65 mm |
0.65 mm |
0.95 mm |
0.95 mm |
- |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
- |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
宽度 |
2.2 mm |
2.2 mm |
1.6 mm |
1.6 mm |
- |