®
Technical Data Sheet
HydroMark 531 Solder Paste
Water-Soluble, Halide-Free
Product Description
Kester HydroMark 531 is a halide-free, organic acid, water-soluble solder paste that provides users with the highest level
of consistency and performance. Batch after batch, HM531 provides hours of stable stencil life, tack time and repeat-
able brick definition. HM531’s robust printing characteristics result in consistent solder paste volume regardless of idle
time, stencil life and print speed. The activator package in the HM531 is very aggressive and provides superior wetting
to OSP-coated PCB’s and PdAg components. The outstanding batch consistency, anti-slump chemistry, consistent print
volumes, solderability and cleanability make the HM531 an ideal water-soluble solder paste for any application.
Performance Characteristics:
■
Outstanding batch-to-batch
consistency
■
Excellent anti-slump characteristics
minimizing bridging defects
■
Capable of 60+ minute idle times in
printing
■
Capable of print speeds up to
150mm/sec (6in/sec)
■
Excellent solderability to difficult
lead-free metalizations with a lead-
ed paste
■
Residues easily removed with hot
DI water, even up to 8 hours after
soldering as a best process practice
■
Minimal foam in wash systems
■
8+ hour stencil life
■
Classified as ORM0 per J-STD-004
■
Produces minimal voiding
underneath BGA components
■
Compatible with enclosed print head
systems
Standard Applications:
Stencil Printing and Enclosed Head Printing: 90% Metal
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level.
Physical Properties
Data given for Sn63Pb37, 90% metal, -325+500
mesh)
Initial Tackiness (typical):
43 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Solder Ball Test:
Preferred
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Tested to J-STD-005, IPC-TM-650, Method
2.4.45
Viscosity (typical):
1800 poise
Malcom Viscometer @ 10rpm and 25°C
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.2
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Chloride and Bromides:
None
Detected
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Surface Insulation Resistivity (SIR)
(typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Blank
Day 1
Day 4
Day 7
1.9*10
10
Ω
1.1*10
10
Ω
8.3*10
9
Ω
HM531
1.4*10
8
Ω
2.0*10
8
Ω
8.3*10
9
Ω
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.33
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
®
HydroMark 531 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommend-
ed, but different powder particle size distributions are available for standard and fine pitch applications. For specific pack-
aging information see Kester’s Solder Paste Packaging Chart for available sizes. The appropriate combination depends
on process variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
Stainless Steel or 80-90 Durometer Polyurethane
Capable to a maximum speed of 150mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 30-70% RH
Kester Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
240
220
200
180
Recommended Reflow Profile
The recommended reflow profile for HM531 made with either the
Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is simply
a guideline. Since HM531 is a highly active, water-soluble solder
paste, it can solder effectively over a wide range of profiles. HM531
is capable of reflowing at the 235°C peak temperatures required for
fully collapsing lead-free SAC BGA’s for maximum reliability, and
remains easy to clean after these high temperature profiles.
Your optimal profile may be different from the one shown based
on your oven, board and mix of defects. Please contact Kester
Technical Support if you need additional profiling advice.
Peak Temp.
210-230 C
Temperature (C)
160
140
120
100
80
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
330
<1.8 C/Sec
(120 sec. max.)
30-60 sec. typical
Soaking Zone
45-75 sec. typical
Reflow Zone
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Time (sec.)
Cleaning
HM531 residues are best removed using automated cleaning equipment (in-line or batch) within 8 hours of soldering
as a best process suggestion. De-ionized water is recommended for the final rinse. Water temperatures should be 49-
60°C (120-140°F). Kester’s 5768 Bio-Kleen
®
saponifier can also be used in a 1-2% ratio for aqueous cleaning systems if
required for low clearance components. Call Kester Technical Support for details.
Storage, Handling and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow char-
acteristics and overall performance. HM531 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). HM531
should be stabilized at room temperature prior to printing. It is recommended to be removed from refrigeration at least 4
hours prior to being opened and having solder paste placed on the stencil. All containers will have their covers on when
material is not being removed from them. Jars will have the inner plunger pushed down to the level of the solder paste and
the top screwed tight. Cartridges will have both lids on them and stored with the small tip down or on their sides, never
with the large round end down. Contact Kester Technical Support if you require additional advice with regarding storage
and handling of this material. Shelf life is 6 months from the date of manufacture when handled properly.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
