IC INTERFACE CARD 28SOIC
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e4 |
| 长度 | 17.9 mm |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 | 6.5 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| TDA8002CT/B/C1,518 | TDA8002C/CD | TDA8002C/CD-T | TDA8002CT/A/C1,512 | TDA8002CT/B/C1,512 | TDA8002CT/C/C1,512 | TDA8002CT/C/C1,518 | TDA8002CG/C1,518 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC INTERFACE CARD 28SOIC | 输入/输出控制器接口集成电路 smrt crd interfce IC | 输入/输出控制器接口集成电路 smrt crd interfce IC | IC INTERFACE CARD 28-SOIC | IC INTERFACE CARD 28-SOIC | IC INTERFACE CARD 28-SOIC | IC INTERFACE CARD 28SOIC | IC INTERFACE CARD 32-LQFP |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | QFP |
| 包装说明 | SOP, | SOP, | SOP, | SOP, | SOP, | 7.50 MM, PLASTIC, SO-28 | 7.50 MM, PLASTIC, SO-28 | LFQFP, QFP32,.28SQ,20 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 32 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | compliant |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | S-PQFP-G32 |
| 长度 | 17.9 mm | 17.9 mm | 17.9 mm | 17.9 mm | 17.9 mm | 17.9 mm | 17.9 mm | 5 mm |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | LFQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 1.6 mm |
| 最大供电电压 | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Brand Name | NXP Semiconductor | - | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| JESD-609代码 | e4 | e4 | e4 | - | - | e4 | e4 | e3 |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | TIN |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
测试/测量
DSP 与 ARM 处理器
stm32/stm8
电源技术
DSP 与 ARM 处理器
微控制器 MCU
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