IC DEMODULATOR RDS 16DIP
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 商用集成电路类型 | CONSUMER CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e3 |
| 长度 | 21.6 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.7 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3.6 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| SAA6579/V1,112 | SAA6579T/V1,512 | SAA6579T/V1,518 | SAA6579T | SAA6579 | 935164610112 | 935164610518 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC DEMODULATOR RDS 16DIP | IC DEMODULATOR RDS 16SOIC | IC DEMODULATOR RDS 16SOIC | IC SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PDIP16, 0.300 INCH, MO-001, SOT-38-1, PLASTIC, DIP-16, Consumer IC:Other | SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 | SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, | SOP, | SOP, | 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 | 0.300 INCH, MO-001, SOT-38-1, PLASTIC, DIP-16 | SOP, | SOP, |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | unknown | unknown |
| 商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| 长度 | 21.6 mm | 9.9 mm | 9.9 mm | 10.3 mm | 21.6 mm | 10.3 mm | 10.3 mm |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 座面最大高度 | 4.7 mm | 1.75 mm | 1.75 mm | 2.65 mm | 4.7 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5 V | 5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3.6 V | 5 V | 5 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES | YES |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| JESD-609代码 | e3 | e4 | e4 | e4 | e3 | - | - |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 245 | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | 40 | 40 | - | - |
| 零件包装代码 | - | SOP | SOP | SOIC | MO-001 | - | - |
| 针数 | - | 16 | 16 | 16 | 16 | - | - |
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