IC DEMODULATOR RDS 16SOIC
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOP |
包装说明 | SOP, |
针数 | 16 |
制造商包装代码 | SOT162-1 |
Reach Compliance Code | unknown |
商用集成电路类型 | CONSUMER CIRCUIT |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 9.9 mm |
端子数量 | 16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5 V |
最小供电电压 (Vsup) | 5 V |
表面贴装 | YES |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
SAA6579T/V1,512 | SAA6579/V1,112 | SAA6579T/V1,518 | SAA6579T | SAA6579 | 935164610112 | 935164610518 | |
---|---|---|---|---|---|---|---|
描述 | IC DEMODULATOR RDS 16SOIC | IC DEMODULATOR RDS 16DIP | IC DEMODULATOR RDS 16SOIC | IC SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PDIP16, 0.300 INCH, MO-001, SOT-38-1, PLASTIC, DIP-16, Consumer IC:Other | SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 | SPECIALTY CONSUMER CIRCUIT, PDSO16, 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | SOP, | DIP, | SOP, | 7.50 MM, MS-013, SOT-162-1, PLASTIC, SO-16 | 0.300 INCH, MO-001, SOT-38-1, PLASTIC, DIP-16 | SOP, | SOP, |
Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | unknown | unknown |
商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
长度 | 9.9 mm | 21.6 mm | 9.9 mm | 10.3 mm | 21.6 mm | 10.3 mm | 10.3 mm |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP | SOP | DIP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
座面最大高度 | 1.75 mm | 4.7 mm | 1.75 mm | 2.65 mm | 4.7 mm | 2.65 mm | 2.65 mm |
最大供电电压 (Vsup) | 5 V | 5.5 V | 5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 5 V | 3.6 V | 5 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
表面贴装 | YES | NO | YES | YES | NO | YES | YES |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 7.62 mm | 3.9 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
零件包装代码 | SOP | - | SOP | SOIC | MO-001 | - | - |
针数 | 16 | - | 16 | 16 | 16 | - | - |
JESD-609代码 | e4 | e3 | e4 | e4 | e3 | - | - |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | 260 | 245 | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
端子面层 | NICKEL PALLADIUM GOLD | TIN | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | - |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | 40 | 40 | - | - |
功能数量 | - | 1 | - | 1 | 1 | 1 | 1 |
最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
技术 | - | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
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