IC BUS SWITCH 10BIT 24SSOP
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SSOP2 |
包装说明 | PLASTIC, MO-137, SOT-556-1, SSOP-24 |
针数 | 24 |
制造商包装代码 | SOT556-1 |
Reach Compliance Code | unknown |
系列 | CBT/FST/QS/5C/B |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 8.7 mm |
逻辑集成电路类型 | BUS DRIVER |
湿度敏感等级 | 1 |
位数 | 10 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 0.25 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.73 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
Base Number Matches | 1 |
CBT6810DK,118 | CBT6810PW-T | CBT6810DK | CBT6810PW,112 | CBT6810PW,118 | 935272774118 | |
---|---|---|---|---|---|---|
描述 | IC BUS SWITCH 10BIT 24SSOP | 数字总线开关 IC 10-bit bus switch | IC CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, MO-137, SOT-556-1, SSOP-24, Bus Driver/Transceiver | IC BUS SWITCH 10BIT 24TSSOP | IC BUS SWITCH 10BIT 24TSSOP | CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24, PLASTIC, MO-137, SOT-556-1, SSOP-24 |
包装说明 | PLASTIC, MO-137, SOT-556-1, SSOP-24 | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | SSOP, SSOP24,.24 | TSSOP, TSSOP24,.25 | 4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24 | SSOP, |
Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
零件包装代码 | SSOP2 | TSSOP | SSOP | TSSOP2 | TSSOP2 | - |
针数 | 24 | 24 | 24 | 24 | 24 | - |
系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 | R-PDSO-G24 |
JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 |
长度 | 8.7 mm | 7.8 mm | 8.7 mm | - | 7.8 mm | 8.7 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
湿度敏感等级 | 1 | 1 | 1 | - | 1 | - |
位数 | 10 | 10 | 10 | - | 10 | 10 |
功能数量 | 1 | 1 | 1 | - | 1 | 1 |
端口数量 | 2 | 2 | 2 | - | 2 | 2 |
端子数量 | 24 | 24 | 24 | - | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | TSSOP | SSOP | - | TSSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 | - |
传播延迟(tpd) | 0.25 ns | 0.25 ns | 0.25 ns | - | 0.25 ns | 0.25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
座面最大高度 | 1.73 mm | 1.1 mm | 1.73 mm | - | 1.1 mm | 1.73 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4 V | 4 V | 4 V | - | 4 V | 4 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | YES | YES | YES | - | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.65 mm | 0.635 mm | - | 0.65 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 | - |
宽度 | 3.9 mm | 4.4 mm | 3.9 mm | - | 4.4 mm | 3.9 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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